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Journal of Micro/Nanolithography, MEMS, and MOEMS

Fabrication of three-dimensional and submicrometer-scaled microstructures based on metal contact printing and silicon bulk machining
Author(s): Kuo-Lun Kao; Cho-Wei Chang; Yung-Chun Lee
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Paper Abstract

This paper describes a method that contains a series of processes for producing three-dimensional (3-D) microstructures with a feature size in the submicrometer scale. It starts from using a metal contact printing lithography to pattern a thin metal film on the surface of a (100) silicon substrate. The metal film has a hole-array pattern with a hole diameter ranging from 300 nm to 800 nm and is used as an etching mask for silicon bulk machining to create concave pyramid-shaped surface microstructures. Using this bulk-machined silicon substrate as a template, polymer 3-D microstructures are replicated on top of a silicon dioxide (SiO 2 ) layer. Finally, through a dry etching process, 3-D microstructures with a profile similar to the replicated polymer microstructures are formed on the SiO 2 layer. Potential applications of these fabricated SiO 2 microstructures in the light-emitting diode industry will be addressed.

Paper Details

Date Published: 21 May 2014
PDF: 8 pages
J. Micro/Nanolith. MEMS MOEMS 13(2) 023008 doi: 10.1117/1.JMM.13.2.023008
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 13, Issue 2
Show Author Affiliations
Kuo-Lun Kao, National Cheng Kung Univ. (Taiwan)
Cho-Wei Chang, National Cheng Kung Univ. (Taiwan)
Yung-Chun Lee, National Cheng Kung Univ. (Taiwan)

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