Share Email Print

Journal of Micro/Nanolithography, MEMS, and MOEMS

Patterned mask inspection technology with projection electron microscope technique on extreme ultraviolet masks
Format Member Price Non-Member Price
PDF $20.00 $25.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

High-sensitivity extreme ultraviolet (EUV) mask pattern defect detection is one of the major issues remaining to be addressed in device fabrication using extreme ultraviolet lithography. In order to achieve inspection sensitivity and suitability for the 1× nm node, a projection electron microscope (PEM) system is employed that enables high-speed/high-resolution inspection, which is not possible using conventional deep ultraviolet or electron beam inspection systems. By employing higher electron energy in the electron optics (EO) exposure system and by improving the PEM design, we have minimized the aberration that occurs when working with EO systems and we have improved the transmittance of the system. Experimental results showing the improved transmittance were obtained by making electron throughput measurements. To guarantee the tool’s aptness for 16-nm node EUV mask inspection, corresponding sized programmed defects on masks were designed, and the defect detection sensitivity of the EO system was evaluated. Improvements in image resolution and electron throughput have enabled us to detect 16-nm sized defects. The PEM system was integrated into a pattern inspection system for defect detection sensitivity evaluation.

Paper Details

Date Published: 21 February 2014
PDF: 8 pages
J. Micro/Nanolith. MEMS MOEMS 13(1) 013009 doi: 10.1117/1.JMM.13.1.013009
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 13, Issue 1
Show Author Affiliations
Ryoichi Hirano, EUVL Infrastructure Development Ctr., Inc. (Japan)
Susumu Lida, EUVL Infrastructure Development Ctr., Inc. (Japan)
Tsuyoshi Amano, EUVL Infrastructure Development Ctr., Inc. (Japan)
Tsuneo Terasawa, EUVL Infrastructure Development Ctr., Inc. (Japan)
Hidehiro Watanabe, EUVL Infrastructure Development Ctr., Inc. (Japan)
Masahiro Hatakeyama, EBARA Corp. (Japan)
Takeshi Murakami, EBARA Corp. (Japan)
Kenji Terao, EBARA Corp. (Japan)

© SPIE. Terms of Use
Back to Top