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Journal of Micro/Nanolithography, MEMS, and MOEMS

Comparative study of various release methods for gold surface micromachining
Author(s): Akshdeep Sharma; Prachi Jhanwar; Deepak Bansal; Amit Kumar; Maninder Kaur; Shilpi Pandey; Prem Kumar; Dinesh Kumar; Kamaljit Rangra
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Paper Abstract

A comparison of dry and wet release methods for surface micromachining of metallic structures, such as RF MEMS switches, test structures, bridges, and cantilevers is presented. The dry release process is optimized by varying the concentration of O 2 and CF 4 plasma and RF power. The plasma ashing of the sacrificial layer typically results in damage to metallic structures or stress-related deformation due to rise in temperature (<80°C ). A wet release process using critical point drying (CPD) has been investigated to realize gold-electroplated structures with reduced residual stress. The CPD, being a low-temperature (31.1°C) process, is more suitable for compliant structures without any deformation.

Paper Details

Date Published: 5 February 2014
PDF: 7 pages
J. Micro/Nanolith. 13(1) 013005 doi: 10.1117/1.JMM.13.1.013005
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 13, Issue 1
Show Author Affiliations
Akshdeep Sharma, CSIR-Central Electronics Engineering Research Institute (India)
Prachi Jhanwar, CSIR-Central Electronics Engineering Research Institute (India)
Deepak Bansal, CSIR-Central Electronics Engineering Research Institute (India)
Amit Kumar, CSIR-Central Electronics Engineering Research Institute (India)
Maninder Kaur, CSIR-Central Electronics Engineering Research Institute (India)
Shilpi Pandey, CSIR-Central Electronics Engineering Research Institute (India)
Prem Kumar, CSIR-Central Electronics Engineering Research Institute (India)
Dinesh Kumar, Kurukshetra Univ. (India)
Kamaljit Rangra, CSIR-Central Electronics Engineering Research Institute (India)


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