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Journal of Micro/Nanolithography, MEMS, and MOEMS

Thermally controlled alignment for wafer-scale lithography
Author(s): Euclid E. Moon; Saurabh A. Chandorkar; S. V. Sreenivasan; R. Fabian Pease
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Paper Abstract

A primary limitation in nanoimprint lithography is lack of alignment consistency between multiple fields. Simultaneous imprinting of several fields is highly desirable for enhanced throughput, yet placement errors in template fabrication and other factors limit field-to-field accuracy. Here, we describe a method to improve overlay simultaneously across many fields via continuous, in situ control of localized temperature distributions. In this method, interferometric moiré alignment signals from an array of microscopes are analyzed to form a map of distortion and control the distribution of heat in real time. Thermal cross-talk between fields is minimized using a microchannel wafer chuck. We demonstrate simultaneous operation of feedback loops that stabilize alignment over a 100-mm span to 0.5 nm (3σ).

Paper Details

Date Published: 28 August 2013
PDF: 5 pages
J. Micro/Nanolith. MEMS MOEMS 12(3) 031109 doi: 10.1117/1.JMM.12.3.031109
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 12, Issue 3
Show Author Affiliations
Euclid E. Moon, Massachusetts Institute of Technology (United States)
Saurabh A. Chandorkar, Intel Corp. (United States)
S. V. Sreenivasan, The Univ. of Texas at Austin (United States)
R. Fabian Pease, Stanford Univ. (United States)

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