Share Email Print
cover

Journal of Micro/Nanolithography, MEMS, and MOEMS

Novel automated microassembly mechanism based on on-chip actuators
Author(s): Yuan Xue; Siyuan He
Format Member Price Non-Member Price
PDF $20.00 $25.00

Paper Abstract

The development of a novel automated microassembly mechanism based on on-chip actuators is described. The assembly mechanism utilizes repulsive-force actuators to flip surface-micromachined two-dimensional structures out-of-plane and assemble them in a vertical position. The assembly mechanism is suitable for wafer-level multidevice batch assembly without external interference. Prototypes were fabricated using the PolyMUMPs surface micromachining technology, then tested. The strength of the assembled structures in terms of withstanding external acceleration was calculated and experimentally measured. The measured results showed the assembly strength of 7 g for prototype 1 and 8 to 11 g for prototype 2.

Paper Details

Date Published: 17 January 2013
PDF: 8 pages
J. Micro/Nanolith. 12(1) 013003 doi: 10.1117/1.JMM.12.1.013003
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 12, Issue 1
Show Author Affiliations
Yuan Xue, Ryerson Univ. (Canada)
Siyuan He


© SPIE. Terms of Use
Back to Top