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Journal of Micro/Nanolithography, MEMS, and MOEMS

Packaging of MEMS and MOEMS for harsh environments
Author(s): Julian Kähler; Andrej Stranz; Andreas Waag; Erwin Peiner
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Paper Abstract

A method for die-attach based on sintering of micro- and nano-silver-particles, which is stable in harsh environments, was described. A modified flip-chip bonder providing high placement accuracy was used for precise pick and place die-attach. Components of sensors designed for data logging during deep drilling, i.e., a MEMS vibration sensor and a MOEMS pressure sensor, were assembled and tested at temperatures up to 250°C. Shear tests of bonded devices were performed before and after temperature load. Bonded silicon-on-insulator Wheatstone bridges and GaP-PD were tested by temperature cycling (50 cycles from 100°C up to 250°C).

Paper Details

Date Published: 7 May 2012
PDF: 8 pages
J. Micro/Nanolith. 11(2) 021202 doi: 10.1117/1.JMM.11.2.021202
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 11, Issue 2
Show Author Affiliations
Julian Kähler, Technische Univ. Braunschweig (Germany)
Andrej Stranz, Technische Univ. Braunschweig (Germany)
Andreas Waag, Technische Univ. Braunschweig (Germany)
Erwin Peiner, Technische Univ. Braunschweig (Germany)

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