Share Email Print
cover

Journal of Electronic Imaging

Seamless image stitching by homography refinement and structure deformation using optimal seam pair detection
Author(s): Daeho Lee; Seohyung Lee
Format Member Price Non-Member Price
PDF $20.00 $25.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We propose an image stitching method that can remove ghost effects and realign the structure misalignments that occur in common image stitching methods. To reduce the artifacts caused by different parallaxes, an optimal seam pair is selected by comparing the cross correlations from multiple seams detected by variable cost weights. Along the optimal seam pair, a histogram of oriented gradients is calculated, and feature points for matching are detected. The homography is refined using the matching points, and the remaining misalignment is eliminated using the propagation of deformation vectors calculated from matching points. In multiband blending, the overlapping regions are determined from a distance between the matching points to remove overlapping artifacts. The experimental results show that the proposed method more robustly eliminates misalignments and overlapping artifacts than the existing method that uses single seam detection and gradient features.

Paper Details

Date Published: 20 November 2017
PDF: 10 pages
J. Electron. Imag. 26(6) 063016 doi: 10.1117/1.JEI.26.6.063016
Published in: Journal of Electronic Imaging Volume 26, Issue 6
Show Author Affiliations
Daeho Lee, Kyung Hee Univ. (Republic of Korea)
Seohyung Lee, SAMSUNG Electronics Co., Ltd. (Republic of Korea)


© SPIE. Terms of Use
Back to Top