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Journal of Electronic Imaging • Open Access

Real-time hyperspectral processing for automatic nonferrous material sorting
Author(s): Artzai Picon; Aranzazu Bereciartua; Jone Echazarra; Ovidiu Ghita; Paul F. Whelan; Pedro M. Iriondo

Paper Abstract

The application of hyperspectral sensors in the development of machine vision solutions has become increasingly popular as the spectral characteristics of the imaged materials are better modeled in the hyperspectral domain than in the standard trichromatic red, green, blue data. While there is no doubt that the availability of detailed spectral information is opportune as it opens the possibility to construct robust image descriptors, it also raises a substantial challenge when this high-dimensional data is used in the development of real-time machine vision systems. To alleviate the computational demand, often decorrelation techniques are commonly applied prior to feature extraction. While this approach has reduced to some extent the size of the spectral descriptor, data decorrelation alone proved insufficient in attaining real-time classification. This fact is particularly apparent when pixel-wise image descriptors are not sufficiently robust to model the spectral characteristics of the imaged materials, a case when the spatial information (or textural properties) also has to be included in the classification process. The integration of spectral and spatial information entails a substantial computational cost, and as a result the prospects of real-time operation for the developed machine vision system are compromised. To answer this requirement, in this paper we have reengineered the approach behind the integration of the spectral and spatial information in the material classification process to allow the real-time sorting of the nonferrous fractions that are contained in the waste of electric and electronic equipment scrap.

Paper Details

Date Published: 4 April 2012
PDF: 10 pages
J. Electron. Imaging. 21(1) 013018 doi: 10.1117/1.JEI.21.1.013018
Published in: Journal of Electronic Imaging Volume 21, Issue 1
Show Author Affiliations
Artzai Picon, TECNALIA (Spain)
Aranzazu Bereciartua, TECNALIA (Spain)
Jone Echazarra, TECNALIA (Spain)
Ovidiu Ghita, Dublin City Univ. (Ireland)
Paul F. Whelan, Dublin City Univ. (Ireland)
Pedro M. Iriondo, Univ. del País Vasco (Spain)

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