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Optical Engineering

High-speed optical three-dimensional scanner for automatic solder joint inspection
Author(s): Richard Schneider; Anton Schick; Paul Koellensperger; Takanori Ninomiya
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Paper Abstract

The optical principle of a high-speed three-dimensional scanner that can operate at high and medium resolution was developed on the basis of confocal microscopy. It was shown that 3-D detection of surfaces, essentially independent of surface characteristics such as inclination and reflectivity, is feasible. Shading effects were found to be negligible. A data rate of 2 Mpixel/s and a 3-D resolution of 5 to 15 µm at 150-mm to 1.5-mm height range were achieved. In a factory a highresolution scanner has been operating successfully for automatic solder joint inspection of multichip modules since 1994. Also, a mediumresolution system for solder joint inspection of surface-mounted devices was developed and evaluated. In view of their high inspection reliability, the developed 3-D inspection systems promise to be a powerful tool for use in production lines.

Paper Details

Date Published: 1 October 1997
PDF: 8 pages
Opt. Eng. 36(10) doi: 10.1117/1.601412
Published in: Optical Engineering Volume 36, Issue 10
Show Author Affiliations
Richard Schneider, Siemens AG (Germany)
Anton Schick, Siemens AG (Germany)
Paul Koellensperger, Siemens AG (Germany)
Takanori Ninomiya, Hitachi Ltd. (Japan)


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