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Optical Engineering

Optoelectronic multichip modules for high-speed computer systems and communication networks
Author(s): Seungug Koh; Daniel J. Sadler; Chong Hyuk Ahn
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Paper Abstract

The demand for communication delay and connectivity improvements suggests that optoelectronic multichip modules (OE-MCMs), utilizing photonic and electronic technologies, may provide practical solutions for high-speed interconnection problems at the module level. Design and fabrication issues for integrating optical waveguide and multiple metal layers on a single substrate are described to facilitate the practical implementation of OE-MCMs. In particular, innovative device structures and fabrication strategies are proposed such that OE-MCMs can be fabricated in a batch mode by a well-established IC fabrication process without causing any fabrication compatibility problems. The proposed OE-MCMs utilize optoelectronic interconnection, multichip module packaging, and MEMS fabrication technologies at the module level, and the feasibility of the proposed OE-MCMs has been demonstrated through the fabrication, assembly, and characterization of prototypes.

Paper Details

Date Published: 1 May 1997
PDF: 7 pages
Opt. Eng. 36(5) doi: 10.1117/1.601345
Published in: Optical Engineering Volume 36, Issue 5
Show Author Affiliations
Seungug Koh, Univ. of Dayton (United States)
Daniel J. Sadler, Univ. of Cincinnati (United States)
Chong Hyuk Ahn, Univ. of Cincinnati (United States)

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