Share Email Print
cover

Optical Engineering

Laser microsoldering of tape-automated bonding leads using an Nd:YAG laser end-pumped by a laser diode bar with gradient index lens array coupling
Author(s): Satoshi Yamaguchi; Koichi Chiba; Yoshimasa Saito; Tetsuro Kobayashi
Format Member Price Non-Member Price
PDF $20.00 $25.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Details

Date Published: 1 December 1996
PDF: 6 pages
Opt. Eng. 35(12) doi: 10.1117/1.601084
Published in: Optical Engineering Volume 35, Issue 12
Show Author Affiliations
Satoshi Yamaguchi, Nippon Steel Corp. (Japan)
Koichi Chiba, Nippon Steel Corp. (Japan)
Yoshimasa Saito, Nippon Steel Corp. (Japan)
Tetsuro Kobayashi, Nippon Steel Corp. (Japan)


© SPIE. Terms of Use
Back to Top