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Journal of Micro/Nanolithography, MEMS, and MOEMS

Holistic metrology approach: hybrid metrology utilizing scatterometry, critical dimension-atomic force microscope and critical dimension-scanning electron microscope
Author(s): Alok Vaid; Bin Bin Yan; Yun Tao Jiang; Mark Kelling; Carsten Hartig; John A. Allgair; Peter Ebersbach; Matthew J. Sendelbach; Narender Rana; Ahmad D. Katnani; Erin McLellan; Charles N. Archie; Cornel Bozdog; Helen Kim; Michael Sendler; Susan Ng; Boris Sherman; Boaz Brill; Igor Turovets; Ronen Urensky
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Paper Abstract

Shrinking design rules and reduced process tolerances require tight control of critical dimension (CD) linewidth, feature shape, and profile of the printed geometry. The holistic metrology approach consists of utilizing all available information from different sources such as data from other toolsets, multiple optical channels, multiple targets, etc., to optimize metrology recipe and improve measurement performance. Various in-line CD metrology toolsets such as scatterometry optical CD, CD-SEM, and CD-AFM are typically utilized individually in fabs. Each of these toolsets has its own set of limitations that are intrinsic to specific measurement technique and algorithm. Here we define "hybrid metrology" to be the use of any two or more metrology toolsets in combination to measure the same dataset. We demonstrate the benefits of the hybrid metrology on two test structures: 22-nm-node gate develop inspect and 32-nm-node fin-shaped field effect transistor gate final inspect. We will cover measurement results obtained using typical BKM (nonhybrid, single toolset standard results) as well as those obtained by utilizing the hybrid metrology approach. Measurement performance will be compared using standard metrology metrics; for example, accuracy and precision.

Paper Details

Date Published: 1 October 2011
PDF: 14 pages
J. Micro/Nanolith. MEMS MOEMS 10(4) 043016 doi: 10.1117/1.3655726
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 10, Issue 4
Show Author Affiliations
Alok Vaid, GLOBALFOUNDRIES Inc. (United States)
Bin Bin Yan, GLOBALFOUNDRIES Inc. (United States)
Yun Tao Jiang, GLOBALFOUNDRIES Singapore (Singapore)
Mark Kelling, GLOBALFOUNDRIES Inc. (United States)
Carsten Hartig, GLOBALFOUNDRIES Dresden Module Two, GmbH & Co. KG (Germany)
John A. Allgair, GLOBALFOUNDRIES Inc. (United States)
Peter Ebersbach, GLOBALFOUNDRIES Dresden Module Two, GmbH & Co. KG (Germany)
Matthew J. Sendelbach, IBM Corp. (United States)
Narender Rana, IBM Corp. (United States)
Ahmad D. Katnani, IBM Corp. (United States)
Erin McLellan, IBM Corp. (United States)
Charles N. Archie, IBM Corp. (United States)
Cornel Bozdog, Nova Measuring Instruments Inc. (United States)
Helen Kim, Nova Measuring Instruments Inc. (United States)
Michael Sendler, Nova Measuring Instruments Inc. (United States)
Susan Ng, Nova Measuring Instruments Inc. (United States)
Boris Sherman, Nova Measuring Instruments Ltd. (Israel)
Boaz Brill, Nova Measuring Instruments Ltd. (Israel)
Igor Turovets, Nova Measuring Instruments Ltd. (Israel)
Ronen Urensky, Nova Measuring Instruments Ltd. (Israel)

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