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Journal of Micro/Nanolithography, MEMS, and MOEMS

Cost-driven mask strategies considering parametric yield, defectivity, and production volume
Author(s): Kwangok Jeong; Andrew B. Kahng; Christopher J. Progler
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Paper Abstract

We provide new yield-aware mask strategies to mitigate emerging variability and defectivity challenges. To address variability, we analyze critical dimension variability with respect to reticle size and its impact on parametric yield. With a cost model that incorporates mask, wafer, and processing cost, considering throughput, yield, and manufacturing volume, we assess various reticle strategies (e.g., single-layer reticle, multiple-layer reticle, and small and large size) considering field-size-dependent parametric yield. To address defectivity, we compare parametric yield due to extreme ultraviolet mask blank defects for various reticle strategies in conjunction with reticle floorplan optimizations such as shifting of the mask pattern within a mask blank to avoid defects being superposed by performance-critical patterns of a design.

Paper Details

Date Published: 1 July 2011
PDF: 13 pages
J. Micro/Nanolith. MEMS MOEMS 10(3) 033021 doi: 10.1117/1.3633246
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 10, Issue 3
Show Author Affiliations
Kwangok Jeong, Univ. of California, San Diego (United States)
Andrew B. Kahng, Univ. of California, San Diego (United States)
Christopher J. Progler, Photronics, Inc. (United States)

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