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Optical Engineering

Analytical model for crosstalk analysis of optoelectronic transmitter modules for optical interconnects
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Paper Abstract

In this paper, a crosstalk expression and equivalent circuit model have been proposed based on RLC line model and interconnect parameters for wire-bonded and flip-chip bonded multichannel optoelectronic modules. The analytical expression and model are accurate for computing crosstalk of interconnects used in chip packaging. In addition, full-wave simulation and experimental results from total crosstalk measurement are discussed.

Paper Details

Date Published: 1 July 2011
PDF: 9 pages
Opt. Eng. 50(7) 075401 doi: 10.1117/1.3600768
Published in: Optical Engineering Volume 50, Issue 7
Show Author Affiliations
Ikechi A. Ukaegbu, KAIST (Korea, Republic of)
Jamshid Sangirov, KAIST (Korea, Republic of)
Mu Hee Cho, KAIST (Korea, Republic of)
Tae-Woo Lee, KAIST (Korea, Republic of)
Hyo-Hoon Park, KAIST (Korea, Republic of)


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