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Journal of Nanophotonics

Lithography-free glass surface modification by self-masking during dry etching
Author(s): Eric A. Hein; Dennis Fox; Henning Fouckhardt
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Paper Abstract

Glass surface morphologies with defined shapes and roughness are realized by a two-step lithography-free process: deposition of an ∼10-nm-thin lithographically unstructured metallic layer onto the surface and reactive ion etching in an Ar/CF4 high-density plasma. Because of nucleation or coalescence, the metallic layer is laterally structured during its deposition. Its morphology exhibits islands with dimensions of several tens of nanometers. These metal spots cause a locally varying etch velocity of the glass substrate, which results in surface structuring. The glass surface gets increasingly rougher with further etching. The mechanism of self-masking results in the formation of surface structures with typical heights and lateral dimensions of several hundred nanometers. Several metals, such as Ag, Al, Au, Cu, In, and Ni, can be employed as the sacrificial layer in this technology. Choice of the process parameters allows for a multitude of different glass roughness morphologies with individual defined and dosed optical scattering.

Paper Details

Date Published: 1 January 2011
PDF: 14 pages
J. Nanophoton. 5(1) 051703 doi: 10.1117/1.3586787
Published in: Journal of Nanophotonics Volume 5, Issue 1
Show Author Affiliations
Eric A. Hein, Technische Univ. Kaiserslautern (Germany)
Dennis Fox, Technische Univ. Kaiserslautern (Germany)
Henning Fouckhardt, Technische Univ. Kaiserslautern (Germany)


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