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Journal of Micro/Nanolithography, MEMS, and MOEMS

Wafer-level vacuum packaging with lateral interconnections and vertical feedthroughs for microelectromechanical system gyroscopes
Author(s): Qian Cheng Zhao; Zhen Chuan Yang; Zhong Yang Guo; Hai Tao Ding; Mo Li; Gui Zhen Yan
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Paper Abstract

A wafer-level vacuum packaging based on anodic bonded glass-silicon-glass triple stack with both lateral interconnections and vertical feedthroughs is presented. A z-axis gyroscope is packaged and tested to verify the packaging process. The packaged gyroscope achieved a Q factor of 26000, increased by a factor of 30 when compared to the same gyroscope without vacuum packaging. The pressure in the packaged cavity is ∼100 Pa, and the stability of the Q factor in three months is ∼3%. Experiment results indicate that the proposed wafer-level vacuum packaging is feasible and suitable for high-performance wafer-level packaged gyroscopes.

Paper Details

Date Published: 1 January 2011
PDF: 5 pages
J. Micro/Nanolith. 10(1) 011507 doi: 10.1117/1.3565459
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 10, Issue 1
Show Author Affiliations
Qian Cheng Zhao, Peking Univ. (China)
Zhen Chuan Yang, Peking Univ. (China)
Zhong Yang Guo, Peking Univ. (China)
Hai Tao Ding, Peking Univ. (China)
Mo Li, Peking Univ. (China)
Gui Zhen Yan, Peking Univ. (China)


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