Share Email Print
cover

Journal of Micro/Nanolithography, MEMS, and MOEMS

Comparing positive and negative tone development process for printing the metal and contact layers of the 32- and 22-nm nodes
Format Member Price Non-Member Price
PDF $20.00 $25.00

Paper Abstract

A strong demand exists for techniques that extend application of ArF immersion lithography. Besides techniques such as litho-friendly design, dual exposure/patterning schemes, customized illumination, alternative processing schemes are also viable candidates. One of the most promising alternative flows uses image reversal by means of a negative tone development (NTD) step with a Fujifilm solvent-based developer. Traditionally, contact and trench printing uses a dark-field mask in combination with positive tone resist and positive tone development. With NTD, the same features are printed in positive resist using light-field masks, and consequently with better image contrast. We present an overview of NTD applications, comparing the NTD performance to that of the traditional development. Experimental work is performed at a 1.35 numerical aperture, targeting the contact/metal layers of the 32- and 22-nm nodes. For contact printing, we consider both single- and dual-exposure schemes for regular arrays and 2-D patterns. For trench printing, we study 1-D, line end, and 2-D patterns. We also assess the etch capability and critical dimension uniformity performance of the NTD process. We proves the added value of NTD. It enables us to achieve a broader pitch range and/or smaller litho targets, which makes NTD attractive for the most advanced lithography applications, including double patterning.

Paper Details

Date Published: 1 October 2010
PDF: 10 pages
J. Micro/Nanolith. 9(4) 043007 doi: 10.1117/1.3524829
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 9, Issue 4
Show Author Affiliations
Joost P. M. Bekaert, IMEC (Belgium)
Lieve Van Look, IMEC (Belgium)
Vincent P. Truffert, IMEC (Belgium)
Frederic Lazzarino, IMEC (Belgium)
Geert Vandenberghe, IMEC (Belgium)
Mario Reybrouck, FUJIFILM Corp. (Japan)
Shinji Tarutani, FUJIFILM Corp. (Japan)


© SPIE. Terms of Use
Back to Top