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Journal of Micro/Nanolithography, MEMS, and MOEMS • Open Access

Use of conductive adhesive for MEMS interconnection in ammunition fuze applications
Author(s): Jakob Gakkestad; Per Dalsjo; Helge Kristiansen; Rolf Johannessen; Maaike M. Visser Taklo

Paper Abstract

A novel conductive adhesive is used to interconnect MEMS test structures with different pad sizes directly to a printed circuit board (PCB) in a medium caliber ammunition fuze. The fuze environment is very demanding, with a setback acceleration exceeding 60,000 g and a centripetal acceleration increasing radially with 9000 g/mm. The adhesive shows excellent mechanical and thermal properties. The mounted MEMS test structures perform well when subjected to rapid temperature cycling according to military-standard 883G method 1010.8 test condition B. The test structures pass 100 temperature cycles, followed by a firing test where the test structures are exposed to an acceleration of more than 60,000 g.

Paper Details

Date Published: 1 October 2010
PDF: 10 pages
J. Micro/Nanolith. 9(4) 041108 doi: 10.1117/1.3504691
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 9, Issue 4
Show Author Affiliations
Jakob Gakkestad, Norwegian Defence Research Establishment (Norway)
Per Dalsjo, Norwegian Defence Research Establishment (Norway)
Helge Kristiansen, Conpart AS (Norway)
Rolf Johannessen, SINTEF (Norway)
Maaike M. Visser Taklo, SINTEF (Norway)


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