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Optical Engineering

Spectral imaging method for material classification and inspection of printed circuit boards
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Paper Abstract

We propose a spectral imaging method for material classification and inspection of raw printed circuit boards (PCBs). The method is composed of two steps (1) estimation the PCB surface-spectral reflectances and (2) unsupervised classification of the reflectance data to make the inspection of PCB easy and efficient. First, we develop a spectral imaging system that captures high dynamic range images of a raw PCB with spatially and spectrally high resolutions in the region of visible wavelength. The surface-spectral reflectance is then estimated at every pixel point from multiple spectral images, based on the reflection characteristics of different materials. Second, the surface-spectral reflectance data are classified into several groups, according to the number of PCB materials. We develop an unsupervised classification algorithm incorporating both spectral information and spatial information, based on the Nystrom approximation of the normalized cut method. The initial seeds for the Nystrom procedure are effectively chosen using a guidance module based on the K-means algorithm. Low-dimensional spectral features are efficiently extracted from the original high-dimensional spectral reflectance data. The feasibility of the proposed method is examined in experiments using real PCBs in detail.

Paper Details

Date Published: 1 May 2010
PDF: 10 pages
Opt. Eng. 49(5) 057201 doi: 10.1117/1.3430606
Published in: Optical Engineering Volume 49, Issue 5
Show Author Affiliations
Abdelhameed F. Ibrahim, Chiba Univ. (Japan)
Shoji Tominaga, Chiba Univ. (Japan)
Takahiko Horiuchi, Chiba Univ. (Japan)

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