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Journal of Micro/Nanolithography, MEMS, and MOEMS

Lifting angle of polyimide self-assembly surface-micromachined structure
Author(s): I-Yu Huang; Yen-Chi Lee; Chang-Yu Lin; Pin-En Ho
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Paper Abstract

This study presents a polyimide (PI) self-assembly technique for developing a 3-D surface-micromachined structure. The effects of geometric factors and curing temperatures of PI elastic joints on the lifting angles of such 3-D microstructures are investigated. Under the optimized curing condition (380°C), a maximum 74-deg lifting angle of 5.2×10−11 kg-weight polysilicon microplate is achieved utilizing a large thermal shrinkage force of a single PI joint. Before severe cross-linkage occurred (curing at 390 to 400°C), the lifting angle of the thermally actuated 3-D microstructure is nearly in direct proportion to the length/width-thickness ratio of the PI joint (with linearity of 95.5%) and the difference between curing and room temperatures (with linearity of 92.3 to 97%). The PI-based self-assembly process is very suitable for mass production due to its high yield of fabrication (80 to 91.6%) and high compatibility with the present IC and MEMS manufacturing processes.

Paper Details

Date Published: 1 April 2010
PDF: 6 pages
J. Micro/Nanolith. 9(2) 023006 doi: 10.1117/1.3385769
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 9, Issue 2
Show Author Affiliations
I-Yu Huang, National Sun Yat-Sen Univ. (Taiwan)
Yen-Chi Lee, National Sun Yat-Sen Univ. (Taiwan)
Chang-Yu Lin, Industrial Technology Research Institute (Taiwan)
Pin-En Ho, National Sun Yat-Sen Univ. (Taiwan)


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