Share Email Print
cover

Journal of Micro/Nanolithography, MEMS, and MOEMS

Full-chip characterization of compression algorithms for direct-write maskless lithography systems
Author(s): Vito Dai; Avideh Zakhor; George R. Cramer
Format Member Price Non-Member Price
PDF $20.00 $25.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Future lithography systems must produce more dense microchips with smaller feature sizes while maintaining throughput comparable to today's optical lithography systems. This places stringent data-handling requirements of up to 12 Tb/s on the design of any maskless lithography system. In past work, we have developed data-path architectures for such throughput and shown that lossless compression algorithms play a key role in such systems. We currently investigate the effectiveness of the Block C4 lossless layout compression algorithm in increasing throughput of direct-write maskless lithography systems. In particular, we characterize the compression efficiency of Block C4 on 1024×1024 blocks of select layers of two 65-nm chips: a state-of-the-art microprocessor chip and a low-density parity code chip used commonly in wireless communication applications. Overall, we have found that compression efficiency varies significantly from design to design, from layer to layer, and even within parts of the same layer. We propose a number of ways to cope with the variation of compression ratios within a layer and characterize the way each method affects the overall wafer layer throughput.

Paper Details

Date Published: 1 January 2010
PDF: 11 pages
J. Micro/Nanolith. 9(1) 013055 doi: 10.1117/1.3366553
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 9, Issue 1
Show Author Affiliations
Vito Dai, GLOBALFOUNDRIES Inc. (United States)
Avideh Zakhor, Univ. of California, Berkeley (United States)
George R. Cramer, Univ. of California, Berkeley (United States)


© SPIE. Terms of Use
Back to Top