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Journal of Micro/Nanolithography, MEMS, and MOEMS

Errata: Design-specific variation in pattern transver by via/contact etch process: full-chip analysis
Author(s): Valeriy Sukharev; Ara Markosian; Armen Kteyan; Levon Manukyan; Nikolay Khachatryan; Jun-Ho Choy; Hasmik Lazaryan; Henrik Hovsepyan; Seiji Onoue; Takuo Kikuchi; Tetsuya Kamigaki
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Paper Abstract

This PDF file contains the errata for “JM3 Vol. 9 Issue 01 Paper 3314279” for JM3 Vol. 9 Issue 01

Paper Details

Date Published: 1 January 2010
J. Micro/Nanolith. MEMS MOEMS 9(1) 019801 doi: 10.1117/1.3314279
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 9, Issue 1
Show Author Affiliations
Valeriy Sukharev, Mentor Graphics Corp. (United States)
Ara Markosian, Mentor Graphics Corp. (United States)
Armen Kteyan, Mentor Graphics Corp. (Armenia)
Levon Manukyan, Mentor Graphics Corp. (Armenia)
Nikolay Khachatryan, Mentor Graphics Corp. (Armenia)
Jun-Ho Choy, Mentor Graphics Corp. (United States)
Hasmik Lazaryan, Mentor Graphics Corp. (Armenia)
Henrik Hovsepyan, Mentor Graphics Corp. (Armenia)
Seiji Onoue, Toshiba Corp. (Japan)
Takuo Kikuchi, Toshiba Corp. (Japan)
Tetsuya Kamigaki, Toshiba Microelectronics Corp. (Japan)

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