Share Email Print

Journal of Electronic Imaging

Improved algorithm for automated alignment of wafers via optimized features location
Author(s): Michael Parshin; Zeev Zalevsky
Format Member Price Non-Member Price
PDF $20.00 $25.00

Paper Abstract

We present a new fuzzy logic-based approach for automatic optimized features location. The technique is used for improved automatic alignment and classification of silicon wafers and chips that are used in the electronics industry. The proposed automatic image processing approach was realized and experimentally demonstrated in real industrial application with typical wafers. The automatic features location and grading supported the industrial requirements and could replace human expert-based inspection that currently is performed manually.

Paper Details

Date Published: 1 October 2009
PDF: 10 pages
J. Electron. Imaging. 18(4) 043001 doi: 10.1117/1.3243882
Published in: Journal of Electronic Imaging Volume 18, Issue 4
Show Author Affiliations
Michael Parshin, Bar-Ilan Univ. (Israel)
Zeev Zalevsky, Bar-Ilan Univ. (Israel)

© SPIE. Terms of Use
Back to Top