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Journal of Micro/Nanolithography, MEMS, and MOEMS

Improved solid-state planar Ti/Pd/Ag/AgCl/KCl-gel microreference electrode by silicon cap sealing package
Author(s): I-Yu Huang; Shih-Han Wang; Chi-Chih Chu; Chien-Tai Chiu
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Paper Abstract

Although solid-state microreference electrodes (µREs) have been developed for electrochemical and biomedical sensing applications for more than one decade, there are very few studies devoted to improving their performance through packaging. Using planar technology and a silicon cap sealing method, we implement a packaged Ti/Pd/Ag/AgCl/KCl-gel µRE with a total dimension of only 9 mm (L)×6 mm (W)×1 mm (H), a hundredfold less than the commercial Ag/AgCl reference electrode (RE). Compared with the unpackaged µRE, the presented chip-level packaged µRE demonstrates many improved characteristics, including a very stable cell potential (5-mV drift voltage in 30,000 s), an approximately zero offset voltage (−7 mV), a very low impedance (1.50 kΩ) and phase shift (8.98 deg) at 1-kHz operation frequency, a very small double-layer capacitance (0.04 µF), and a very high reproducibility (±3.1-mV).

Paper Details

Date Published: 1 July 2009
PDF: 9 pages
J. Micro/Nanolith. 8(3) 033050 doi: 10.1117/1.3196547
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 8, Issue 3
Show Author Affiliations
I-Yu Huang, National Sun Yat-sen Univ. (Taiwan)
Shih-Han Wang, I-Shou Univ. (Taiwan)
Chi-Chih Chu, National Sun Yat-Sen Univ. (Taiwan)
Chien-Tai Chiu, National Sun Yat-Sen Univ. (Taiwan)


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