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Journal of Micro/Nanolithography, MEMS, and MOEMS

Electromechanical behavior of the curled cantilever beam
Author(s): Wan-Chun Chuang; Yuh-Chung Hu; Chi-Yuan Lee; Wen-Pin Shih; Pei-Zen Chang
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Paper Abstract

We propose an approximate analytical solution to the pull-in voltage of a microcurled cantilever beam. The analytical model considers the realistic situations, which include stress gradient, nonideal boundary conditions, and fringing field capacitance. The proposed analytical model can be used at wafer level for extracting the Young's modulus of the thin film of which the cantilever beam is made. The approximate analytical solution is obtained based on the Euler's beam model and the minimum energy method. The accuracy of the proposed model is verified to be more accurate than the other published models. The model presented in this work can be used for wafer-level evaluation of the material properties through simple electrical testing and is also expected to find use in the design of microelectromechanical devices.

Paper Details

Date Published: 1 July 2009
PDF: 8 pages
J. Micro/Nanolith. 8(3) 033020 doi: 10.1117/1.3158355
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 8, Issue 3
Show Author Affiliations
Wan-Chun Chuang, National Taiwan Univ. (Taiwan)
Yuh-Chung Hu, Huafan Univ. (Taiwan)
Chi-Yuan Lee, Yuan Ze Univ. (Taiwan)
Wen-Pin Shih, National Taiwan Univ. (Taiwan)
Pei-Zen Chang, National Taiwan Univ. (Taiwan)


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