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Optical Engineering • Open Access

Fabrication and characterization of integrated three-dimensional linear taper on silicon-on-insulator
Author(s): Zhifeng Yang; Na Fang; Aimin Wu; Jing Chen; Miao Zhang; Xi Wang; Shichang Zou

Paper Abstract

Fabrication and characterization of an integrated 3-D linear taper are reported, which is based on (111) silicon-on-insulator for efficient coupling between a single-mode fiber and planar photonic devices. The fabrication process involved wafer bonding, anisotropic etching, and dry etching. The 3-D taper measured 75 μm in length. The input waveguide, 5.6×5 μm2 in dimensions of the end facet, was compressed to dimensions of 0.6×1.8 μm2 of the end facet in the output waveguide. The measured average net transmission loss was 0.52 dB at the wavelength of 1.55 μm.

Paper Details

Date Published: 1 March 2009
PDF: 3 pages
Opt. Eng. 48(3) 030503 doi: 10.1117/1.3095916
Published in: Optical Engineering Volume 48, Issue 3
Show Author Affiliations
Zhifeng Yang, Shanghai Institute of Microsystem and Information Technology (China)
Na Fang, Shanghai Institute of Microsystem and Information Technology (China)
Aimin Wu, Shanghai Institute of Microsystem and Information Technology (China)
Jing Chen, Shanghai Institute of Microsystem and Information Technology (China)
Miao Zhang, Shanghai Institute of Microsystem and Information Technology (China)
Xi Wang, Shanghai Institute of Microsystem and Information Technology (China)
Shichang Zou, Shanghai Institute of Microsystem and Information Technology (China)


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