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Journal of Micro/Nanolithography, MEMS, and MOEMS

Low-temperature wet-release process for low stiffness structures
Author(s): Jaibir Sharma; Amitava DasGupta
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Paper Abstract

A low-temperature wet-release process for low stiffness structures fabricated using material of low Young's modulus has been developed and presented. The release process is described in the light of different forces that cause stiction during release. This technique is successfully demonstrated for different low stiffness structures with gold as the membrane material and positive photoresist or SiO2 as the sacrificial layer.

Paper Details

Date Published: 1 October 2008
PDF: 5 pages
J. Micro/Nanolith. 7(4) 043007 doi: 10.1117/1.2990733
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 7, Issue 4
Show Author Affiliations
Jaibir Sharma, Indian Institute of Technology Madras (India)
Amitava DasGupta, Indian Institute of Technology Madras (India)


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