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Journal of Micro/Nanolithography, MEMS, and MOEMS

High-resolution permanent photoresist laminate for microsystem applications
Author(s): U. Stohr; P. Vulto; P. Hoppe; Gerald A. Urban; Holger Reinecke
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Paper Abstract

A new permanent dry film photoresist, TMMF S2000, is tested and evaluated for microsystem applications. The resist provides high resolution, high aspect ratios, and homogeneous resist thicknesses. Aspect ratios up to 6:1 (height:width) may be achieved for both structures and channels. Buried structures are created by covering channels with a laminated resist layer. In addition, a very fast direct wafer bonding process is developed. In this process, the resist is patterned on a wafer and directly bonded to a second wafer using pressure and heat. Both techniques enable the fabrication of microfluidic chips with high aspect ratio structures.

Paper Details

Date Published: 1 July 2008
PDF: 6 pages
J. Micro/Nanolith. 7(3) 033009 doi: 10.1117/1.2964217
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 7, Issue 3
Show Author Affiliations
U. Stohr, Albert-Ludwigs-Univ. Freiburg (Germany)
P. Vulto, Albert-Ludwigs-Univ. Freiburg (Germany)
P. Hoppe, Albert-Ludwigs-Univ. Freiburg (Germany)
Gerald A. Urban, Albert-Ludwigs-Univ. Freiburg (Germany)
Holger Reinecke, Albert-Ludwigs-Univ. Freiburg (Germany)


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