Share Email Print

Journal of Micro/Nanolithography, MEMS, and MOEMS

Wafer scale integration of catalyst dots into nonplanar microsystems
Author(s): Kjetil Gjerde; Jakob Kjelstrup-Hansen; Lauge Gammelgaard; Peter Bøggild
Format Member Price Non-Member Price
PDF $20.00 $25.00

Paper Abstract

In order to successfully integrate bottom-up fabricated nanostructures such as carbon nanotubes or silicon, germanium, or III-V nanowires into microelectromechanical systems on a wafer scale, reliable ways of integrating catalyst dots are needed. Here, four methods for integrating sub-100-nm diameter nickel catalyst dots on a wafer scale are presented and compared. Three of the methods are based on a p-Si layer utilized as an in situ mask, an encapsulating layer, and a sacrificial window mask, respectively. All methods enable precise positioning of nickel catalyst dots at the end of a microcantilever, while avoiding contamination of the used cleanroom process equipment. The methods are suitable for fabrication of scanning probe tips and nanoelectrodes for advanced characterization probes.

Paper Details

Date Published: 1 October 2007
PDF: 9 pages
J. Micro/Nanolith. MEMS MOEMS 6(4) 043014 doi: 10.1117/1.2811948
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 6, Issue 4
Show Author Affiliations
Kjetil Gjerde, Statoil ASA (Norway)
Jakob Kjelstrup-Hansen, Syddansk Univ. (Denmark)
Lauge Gammelgaard, Danmarks Tekniske Univ. (Denmark)
Peter Bøggild, Danmarks Tekniske Univ. (Denmark)

© SPIE. Terms of Use
Back to Top