Share Email Print

Journal of Micro/Nanolithography, MEMS, and MOEMS

Measuring thin film elastic modulus using a micromachined cantilever bending test by nanoindenter
Author(s): Changchun Hsu; Chingfu Tsou; Weileun Fang
Format Member Price Non-Member Price
PDF $20.00 $25.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

It is convenient to characterize thin film material properties using commercially available nanoindentation systems. This study aims to discuss several considerations while determining the thin film elastic modulus by means of a microcantilever bending test using a commercial nanoindentation system. The measurement results are significantly improved after: 1. the indentation of the film during the test is considered and corrected, and 2. the boundary effects are considered in the model by finite element method. In application, the elastic modulus of electroplating nickel film 11 μm thick was characterized.

Paper Details

Date Published: 1 July 2007
PDF: 7 pages
J. Micro/Nanolith. MEMS MOEMS 6(3) 033011 doi: 10.1117/1.2778431
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 6, Issue 3
Show Author Affiliations
Changchun Hsu, National Tsing Hua Univ. (Taiwan)
Chingfu Tsou, Feng Chia Univ. (Taiwan)
Weileun Fang, National Tsing Hua Univ. (Taiwan)

© SPIE. Terms of Use
Back to Top