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Journal of Micro/Nanolithography, MEMS, and MOEMS

Through-process modeling for design-for-manufacturability applications
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Paper Abstract

In recent years, design for manufacturability (DFM) has become an important focus item of the semiconductor industry and many new DFM applications have arisen. Most of these applications rely heavily on the ability to model process sensitivity, and here we explore the role of through-process modeling on DFM applications. Several different DFM applications are examined and their lithography model requirements analyzed. The complexities of creating through-process models are then explored, and methods to ensure their accuracy presented.

Paper Details

Date Published: 1 July 2007
PDF: 9 pages
J. Micro/Nanolith. 6(3) 031007 doi: 10.1117/1.2774987
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 6, Issue 3
Show Author Affiliations
Scott M. Mansfield, IBM Microelectronics Div. (United States)
Geng Han, IBM Microelectronics Div. (United States)
Lars W. Liebmann, IBM Microelectronics Div. (United States)


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