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Journal of Micro/Nanolithography, MEMS, and MOEMS

Flip bonding with SU-8 for hybrid AlxGa1-xAs-polysilicon MEMs-tunable filter
Author(s): Edward M. Ochoa; Lavern A. Starman; Robert G. Bedford; Thomas R. Nelson; James E. Ehret; Michael Harvey; Travis Anderson; Fan Ren
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Paper Abstract

We report the influence of bonding temperature on SU-8 to SU-8 bonding and report fabrication of a hybrid microelectromechanical-tunable filter (MEM-TF) using SU-8 bond pads. We demonstrate use of 2-μm-thick 50×50-μm2 SU-8 bond pads to attach 4.92-μm-thick 250×250-μm2 Al0.4Ga0.6As-GaAs distributed Bragg reflectors (DBR) to polysilicon MUMPs® piston actuators. Advantages of this process include compatibility with hydrofluoric-acid-release chemistry, low-temperature/low-pressure bonding, simple bond-pad photolithography, 57% flip-bonded DBR yield, and 30% electrostatically actuatable hybrid MEM-TF yield.

Paper Details

Date Published: 1 July 2007
PDF: 4 pages
J. Micro/Nanolith. 6(3) 033007 doi: 10.1117/1.2767326
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 6, Issue 3
Show Author Affiliations
Edward M. Ochoa, Air Force Institute of Technology (United States)
Lavern A. Starman, Air Force Institute of Technology (United States)
Robert G. Bedford, Air Force Research Lab. (United States)
Thomas R. Nelson, Air Force Research Lab. (United States)
James E. Ehret, Air Force Research Lab. (United States)
Michael Harvey, U. S. Air Force (United States)
Travis Anderson, Univ. of Florida (United States)
Fan Ren, Univ. of Florida (United States)


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