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Journal of Micro/Nanolithography, MEMS, and MOEMS

Heat transfer improvement in quasi-monolithic integration technology
Author(s): Mojtaba Joodaki; Guenter Kompa; Hartmut H. Hillmer; Rainer Kassing
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Paper Abstract

Static thermal analyses for the earlier concept and the enhanced quasi-monolithic integration technology (QMIT) are performed in detail. The effects of several parameters such as the properties of the materials involved and different geometries in all possible structures are described. Simulation results confirm a very low thermal resistance for the enhanced QMIT structure and highlight its superiority to the earlier concept of QMIT structures. This leads to a longer lifetime, a higher reliability and a better performance of the packaging.

Paper Details

Date Published: 1 July 2005
PDF: 7 pages
J. Micro/Nanolith. 4(3) 033011 doi: 10.1117/1.2008968
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 4, Issue 3
Show Author Affiliations
Mojtaba Joodaki, Infineon Technologies AG (Germany)
Guenter Kompa, Univ. Gesamthochschule Kassel (Germany)
Hartmut H. Hillmer, Univ. Kassel (Germany)
Rainer Kassing

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