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Optical Engineering

Ultraviolet laser ablation patterning of oxide films for optical applications
Author(s): Jürgen Ihlemann
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Paper Abstract

Deep-UV (248 nm, 193 nm) excimer laser ablation is used to pattern thin oxide films or layer stacks. The ablation of extended areas as well as submicrometer structuring is possible. Due to their optical, chemical, and thermal stability, these inorganic films are better suited for optical applications compared to organic films, especially if UV transparency is required. The ablation of SiO2, Al2O3, HfO2, and Ta2O5 layers and combinations is investigated. Patterned films can be used as masks, diffractive phase elements, or gratings.

Paper Details

Date Published: 1 May 2005
PDF: 5 pages
Opt. Eng. 44(5) 051108 doi: 10.1117/1.1904602
Published in: Optical Engineering Volume 44, Issue 5
Show Author Affiliations
Jürgen Ihlemann, Laser Laboratorium Gottingen e.V. (Germany)

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