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Optical Engineering

Fabrication of fiber-embedded boards using grooving technique for optical interconnection applications
Author(s): Han Seo Cho; Saekyoung Kang; Byung Sup Rho; Hyo-Hoon Park; Kyoung Up Shin; Sang Won Ha; Byoung Ho Rhee; Dong Su Kim; Sun Tae Jung; Taeil I. Kim
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Paper Abstract

A simple method for fabricating fiber-embedded boards using a grooving technique is described that is quite cost effective and fully compatible with conventional printed circuit board (PCB) processes with no necessity for a specially designed wiring machine. FR-4 plates are grooved using a dicing saw machine and followed by placing optical fibers into the grooves. The fiber-embedded PCBs are laminated by conventional PCB processes at a temperature of 180°C for 1 h under 47 kg/cm2 of pressure. The 50/125-µm glass fibers, and the polyimide-coated glass fibers are laminated successfully. In the fiber-embedded boards with a length of 10 cm, the variation of center positions of the embedded glass fibers is about ±5 µm. The transmitted optical power through the fiber-embedded boards shows a good uniformity of less than ±0.5 dB variation from the average value for the 12 fiber channels. Data transmission through the board at data rates of 2.5 Gbits/s is achieved. After confirming the successful laminations and the data transmission with the small-scale fiber-embedded boards, a large-scale prototype of the fiber-embedded board for a backplane application is successfully fabricated.

Paper Details

Date Published: 1 December 2004
PDF: 6 pages
Opt. Eng. 43(12) doi: 10.1117/1.1810530
Published in: Optical Engineering Volume 43, Issue 12
Show Author Affiliations
Han Seo Cho, Information and Communications Univ. (South Korea)
Saekyoung Kang, Information and Communications Univ. (South Korea)
Byung Sup Rho, Korea Photonics Technology Institute (South Korea)
Hyo-Hoon Park, Information and Communications Univ. (South Korea)
Kyoung Up Shin, Samsung Electro-Mechanics Co. (South Korea)
Sang Won Ha, Samsung Electro-Mechanics Co., Ltd. (South Korea)
Byoung Ho Rhee, Samsung Electro-Mechanics Co. (South Korea)
Dong Su Kim, SAMSUNG Electronics Co., Ltd. (South Korea)
Sun Tae Jung, SAMSUNG Electronics Co., Ltd. (South Korea)
Taeil I. Kim, SAMSUNG Electronics Co., Ltd. (South Korea)

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