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Optical Engineering

10-Gbytes/s, three-dimensional parallel optical interconnects using a novel conductive polymer flip-chip process
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Paper Abstract

Micro-optics offers the ability to realize massively parallel, surface-normal interconnects at the chip scale. In this context, we investigate the integration of a 10-Gbytes/s, 850-nm vertical-cavity surface-emitting laser (VCSEL) with a 2×2 array of continuous surface profile, diffractive optical elements to demonstrate a prototype system that incorporates 3-D, highly dense, parallel optical interconnects. The integration is achieved using a novel conductive polymer-based flip-chip process, which is implemented using conventional fabrication techniques. We present experimental results from the design, fabrication, integration, and characterization of the prototype system.

Paper Details

Date Published: 1 November 2004
PDF: 7 pages
Opt. Eng. 43(11) doi: 10.1117/1.1803555
Published in: Optical Engineering Volume 43, Issue 11
Show Author Affiliations
Saurabh K. Lohokare, Univ. of Delaware (United States)
Christopher A. Schuetz, Univ. of Delaware (United States)
Zhaolin Lu, Univ. of Delaware (United States)
Thomas E. Dillon, Univ. of Delaware (United States)
Anita Sure, Univ. of Delaware (United States)
Dennis W. Prather, Univ. of Delaware (United States)

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