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Journal of Micro/Nanolithography, MEMS, and MOEMS

Porous silica frame for deep ultraviolet lithography
Author(s): D. Laurence Meixner; Rahul Ganguli; Troy Robinson; De-Yin Jeng; Mark W. Morris; Satyabrata Ray Chaudhuri; Brian J. Grenon
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Paper Abstract

Several significant technical issues are associated with the current anodized aluminum pellicle frame. These problems will become more acute as shorter wavelengths such as 193 and 157 nm become standard. For example, it is difficult to purge the pellicle space, and the nonporous nature of the aluminum frame can lead to pressure-induced film breakage during transport. In addition, the thermal expansion behavior of aluminum does not match that of the silica substrate, which can lead to pattern distortion or bending of a hard pellicle film. Proposed solutions such as a perforated silica frame or a porous InvarTM frame may address some of these issues, but a complete solution has not been forthcoming. A porous silica frame technology based on sol-gel processing may eliminate concerns associated with the lack of porosity in the aluminum frame, as well as thermal expansion mismatch problems. Several additional advantages may also be realized, including the removal of organic contaminants from inside the pellicle space, filtration of particulate contaminants, and stability under aggressive cleaning. This approach to a porous silica frame may help enable a cost-effective route to more rapid commercialization of shorter-wavelength microlithographic processes.

Paper Details

Date Published: 1 July 2004
PDF: 96 pages
J. Micro/Nanolith. MEMS MOEMS 3(3) doi: 10.1117/1.1758949
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 3, Issue 3
Show Author Affiliations
D. Laurence Meixner, YTC America Inc. (United States)
Rahul Ganguli, YTC America Inc. (United States)
Troy Robinson, YTC America Inc. (United States)
De-Yin Jeng, YTC America Inc. (United States)
Mark W. Morris, YTC America Inc. (United States)
Satyabrata Ray Chaudhuri, YTC America Inc. (United States)
Brian J. Grenon, Grenon Consulting, Inc. (United States)

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