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Journal of Micro/Nanolithography, MEMS, and MOEMS

Stereolithographic patterning of diazonaphthoquinone/novolac photoresist
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Paper Abstract

A fabrication process has been developed which prevents solvent intermixing between layers of diazonaphthoquinone/novolac (DNQ/novolac) based resist. The process enables three-dimensional structures to be batch fabricated stereolithographically using integrated circuit-compatible resist, coating, and exposure techniques, followed by a single development step. To prevent solvent intermixing, a combination of solvent tailoring and surface treatment is employed. The photoresist is first constituted into a weaker, less polar solvent. Before coating a new layer, the surface is exposed to ozone, thus increasing the hydrophilicity of the surface and providing a less soluble barrier layer. This enables the formation of a stack of successively photoimaged layers of the same material, which are then developed in a single step. A new interlayer dose modulation technique to optimize the development process in positive tone resists such as DNQ/novolac is also described.

Paper Details

Date Published: 1 April 2004
PDF: 9 pages
J. Micro/Nanolith. 3(2) doi: 10.1117/1.1668270
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 3, Issue 2
Show Author Affiliations
Theodore M. Bloomstein, MIT Lincoln Lab. (United States)
Stephen T. Palmacci, MIT Lincoln Lab. (United States)
Roderick R. Kunz, MIT Lincoln Lab. (United States)
Mordechai Rothschild, MIT Lincoln Lab. (United States)

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