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Optical Engineering

Infrared diffraction interferometer for coplanarity measurement of high-density solder bump pattern
Author(s): Michael Mello; Bongtae Han; Zhaoyang Wang
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Paper Abstract

An IR diffraction interferometer is proposed for coplanarity measurement of high-density solder bump patterns. The method utilizes long-wavelength (λ= 10.6 μm) coherent infrared laser light, which serves to reduce the apparent roughness of test objects and enables the regularly spaced solder bump arrays to produce well-defined diffracted wavefronts. A single diffracted wavefront is isolated by an optical system and directed to interfere with a reference wavefront to produce a whole-field map of bump topography. An optical configuration similar to classical Fizeau interferometry is implemented to prove the concept.

Paper Details

Date Published: 1 April 2004
PDF: 7 pages
Opt. Eng. 43(4) doi: 10.1117/1.1666861
Published in: Optical Engineering Volume 43, Issue 4
Show Author Affiliations
Michael Mello, Intel Corp. (United States)
Bongtae Han, Univ. of Maryland/College Park (United States)
Zhaoyang Wang, Univ. of Maryland (United States)

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