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Journal of Micro/Nanolithography, MEMS, and MOEMS

Heat-resistant photoresists based on new imaging technique: reaction development patterning
Author(s): Takafumi Fukushima; Yukiko Kawakami; Akira Kitamura; Toshiyuki Oyama; Masao Tomoi
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Paper Abstract

Spin-coated films of nonphotosensitive engineering thermoplastics mixed with photosensitive agent diazonaphthoquinone (DNQ) can be clearly imaged with near-UV light. The selected engineering thermoplastics are commercially available poly(bisphenol A carbonate), polyarylate (U polymer®) and polyetherimide (Ultem®), and synthesized fluorinated polyimide, which have no specific functional groups. Development with a solution including ethanolamine dissolves the irradiated areas to give positive fine patterns. The two-component photosensitive systems shows good photosensitivity and resolution (line/space 10/10 µm) with about 10 to 15 µm in thickness. Gel-permiation chromatography (GPC) and 1H-NMR measurements that can give information on the structure of components dissolved from the irradiated regions are carried out to make clear the imaging mechanism, which we call reaction development patterning (RDP). RDP-based photosensitive polymers showed high heat resistance up to their glass transition temperature (Tg) or above.

Paper Details

Date Published: 1 January 2004
PDF: 9 pages
J. Micro/Nanolith. 3(1) doi: 10.1117/1.1633273
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 3, Issue 1
Show Author Affiliations
Takafumi Fukushima, Yokohama National Univ. (Japan)
Yukiko Kawakami, Yokohama National Univ. (Japan)
Akira Kitamura, Yokohama National Univ. (Japan)
Toshiyuki Oyama, Yokohama National Univ. (Japan)
Masao Tomoi, Yokohama National Univ. (Japan)


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