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Journal of Micro/Nanolithography, MEMS, and MOEMS

Improvement of current distribution uniformity on substrates for microelectromechanical systems
Author(s): Jong-Min Lee; John T. Hachman; James J. Kelly; Alan C. West
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Paper Abstract

The employment of an insulating shield for the improvement of the current distribution on 3-in. wafer substrates is considered. Numerical analysis is used to evaluate the influence of shield shape and position on the deposition uniformity, and the simulation results are compared to experimental data for nickel deposition from a Ni sulfamate bath. The use of a shield is shown to be an effective and simple way to improve current distribution uniformity, reducing the measured disparity between the average current density and the current density at the substrate center from ~35% to less than about 10% for the cases studied.

Paper Details

Date Published: 1 January 2004
PDF: 6 pages
J. Micro/Nanolith. 3(1) doi: 10.1117/1.1631924
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 3, Issue 1
Show Author Affiliations
Jong-Min Lee, Columbia Univ. (United States)
John T. Hachman, Sandia National Labs. (United States)
James J. Kelly, Sandia National Labs. (United States)
Alan C. West, Columbia Univ. (United States)


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