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Journal of Micro/Nanolithography, MEMS, and MOEMS

Developing a viable multilayer coating process for extreme ultraviolet lithography reticles
Author(s): Paul B. Mirkarimi; Eberhard Adolf Spiller; Sherry L. Baker; Victor R. Sperry; Daniel Gorman Stearns; Eric M. Gullikson
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Paper Abstract

Reticle blanks for extreme ultraviolet lithography (EUVL) are fabricated by depositing reflective Mo/Si multilayer films on superpolished substrates. To obtain a reasonable cost of ownership for EUVL, the multilayer films must be nearly defect free, have excellent reflectance/thickness uniformity, and have a high EUV reflectance. Small particle contaminants on the substrate that can nucleate printable Mo/Si phase defects are a serious concern. We develop an ion-beam thin film planarization process for mitigating the effect of small substrate contaminants that relies on enhancing the smoothing capability of Mo/Si multilayer films; we observe that etching of the Si layers in between deposition steps can yield a significant improvement in smoothing. Using this process substrate particles as large as ~50 nm in diameter are smoothed to ~1 nm in height, rendering them harmless. We further develop this process so that it retains these particle-smoothing capabilities while also achieving a high EUV reflectance and excellent uniformity.

Paper Details

Date Published: 1 January 2004
PDF: 7 pages
J. Micro/Nanolith. MEMS MOEMS 3(1) doi: 10.1117/1.1631006
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 3, Issue 1
Show Author Affiliations
Paul B. Mirkarimi, Lawrence Livermore National Lab. (United States)
Eberhard Adolf Spiller, Spiller X-ray Optics (United States)
Sherry L. Baker, Lawrence Livermore National Lab. (United States)
Victor R. Sperry, Lawrence Livermore National Lab. (United States)
Daniel Gorman Stearns, OrthoSport Associates (United States)
Eric M. Gullikson, Lawrence Berkeley National Lab. (United States)

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