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Optical Engineering

Optical sensor for semiconductor chip bonding
Author(s): Tuck Wah Ng; C.W. Ng
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Paper Abstract

A through-beam configuration optical sensor is designed, fabricated, and tested for chip bonding. The tip taper angle was designed based on a cone condensor theory for maximal optical power collection at the tip's output. Experiments conducted to determine the optical power collected using a series of tip taper angles confirm the general applicability of the cone condenser theorem. The optical sensor was found to perform extremely well when incorporated in an actual chip bonding machine, where chips of 3.4×3.4 mm in dimension were tested.

Paper Details

Date Published: 1 December 2003
PDF: 3 pages
Opt. Eng. 42(12) doi: 10.1117/1.1625379
Published in: Optical Engineering Volume 42, Issue 12
Show Author Affiliations
Tuck Wah Ng, National Univ. of Singapore (Singapore)
C.W. Ng, ESEC Pte. Ltd./Asia Pacific (Singapore)


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