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Journal of Micro/Nanolithography, MEMS, and MOEMS

Performance of a high productivity 300 mm dual stage 193 nm 0.75 NA TWINSCAN AT:1100B system for 100 nm applications
Author(s): Rian Rubingh; Youri van Dommelen; Sjef Tempelaars; Marc Boonman; Roger Irwin; Edwin van Donkelaar; Hans Burgers; Guustaaf Savenije; Bert Koek; Michael Thier; Oliver Roempp; Christian Hembd-Soellner
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Paper Abstract

To realize high productivity at the 100-nm node, ASML developed the TWINSCANTM AT:1100B. This dual-stage 193-nm lithography system combines high throughput TWINSCANTM technology for 300-mm wafers, excellent dynamical performance, and low-aberration 0.75-NA StarlithTM 1100 projection optics. The system is equipped with a 20-W 4-kHz ArF laser and the AERIALTM II illuminator, enabling high intensity off-axis and multipole QUASARTM illumination. Important process control requirements for the 100-nm technology node are CD variation across the chip and across the wafer. Full wafer leveling, including dies on the edge of the wafer, and CD uniformity performance on 300-mm wafers with and without topology are presented, showing full wafer CD uniformity numbers as low as 6.3 nm 3σ for 100-nm isolated lines with assisting features. Imaging performance of dense, fully isolated lines plus dense and isolated contact holes is shown. Also, printing of critical customer structures is discussed. With these results it is demonstrated that the TWINSCANTM AT:1100B 300-mm ArF Step & Scan system meets the requirements for the 100-nm node.

Paper Details

Date Published: 1 January 2003
PDF: 11 pages
J. Micro/Nanolith. MEMS MOEMS 2(1) doi: 10.1117/1.1531190
Published in: Journal of Micro/Nanolithography, MEMS, and MOEMS Volume 2, Issue 1
Show Author Affiliations
Rian Rubingh, ASML (Netherlands)
Youri van Dommelen, ASML (Netherlands)
Sjef Tempelaars, ASML Netherlands B.V. (Netherlands)
Marc Boonman, ASML (Netherlands)
Roger Irwin, ASML (Netherlands)
Edwin van Donkelaar, ASML (Netherlands)
Hans Burgers, ASML (Netherlands)
Guustaaf Savenije, ASML (Netherlands)
Bert Koek, ASML (Netherlands)
Michael Thier, Carl Zeiss SMT AG (Germany)
Oliver Roempp, Carl Zeiss (Germany)
Christian Hembd-Soellner, Carl Zeiss (Germany)

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