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Optical Engineering

Coplanarity study on ball grid array packaging
Author(s): Cho Jui Tay; Xiaoyuan He; Xin Kang; Chenggen Quan; Huai Min Shang
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Paper Abstract

We describe a stereoscopic measurement method to study the coplanarity of solder balls on a ball grid array (BGA) packaging. The optical system consists of two long-focal-length lenses and a two- channel digital image grabber. The proposed technique uses image recognition and digital correlation, which simplify the calculation procedure. The computation requires only a few seconds to calculate the height of a few hundred balls. The technique is suitable for in situ measurement in BGA manufacturing.

Paper Details

Date Published: 1 August 2001
PDF: 5 pages
Opt. Eng. 40(8) doi: 10.1117/1.1386639
Published in: Optical Engineering Volume 40, Issue 8
Show Author Affiliations
Cho Jui Tay, National Univ. of Singapore (Singapore)
Xiaoyuan He, National Univ. of Singapore (Singapore)
Xin Kang, Southeast Univ. (China)
Chenggen Quan, National Univ. of Singapore (Singapore)
Huai Min Shang, National Univ. of Singapore (Singapore)

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