The Moscone Center
San Francisco, California, United States
28 January - 2 February 2017
Conference OE112
Optical Interconnects XVII
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Abstract Due:
18 July 2016

Author Notification:
26 September 2016

Manuscript Due Date:
5 January 2017

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Conference Chairs
  • Henning Schröder, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
  • Ray T. Chen, The Univ. of Texas at Austin (United States)

Program Committee
  • Bill Blubaugh, US Conec Ltd. (United States)
  • Patrick B. Chu, Sandia National Labs. (United States)
  • Alan F. Evans, Corning Incorporated (United States)
  • Alexei L. Glebov, OptiGrate Corp. (United States)
  • Ruth Houbertz, Multiphoton Optics GmbH (Germany)
  • Marika P. Immonen, TTM Technologies, Inc. (Finland)
  • Takaaki Ishigure, Keio Univ. (Japan)
  • Wei Jiang, Rutgers, The State Univ. of New Jersey (United States)
  • Mikko Karppinen, VTT Technical Research Ctr. of Finland (Finland)
  • Christian Koos, Karlsruher Institut für Technologie (Germany)
  • Christopher T. Middlebrook, Michigan Technological Univ. (United States)

Program Committee continued...
Call for
Papers are solicited in the following areas:

Optical interconnect technologies
  • electronic/photonic printed circuit boards and backplanes
  • optical interconnect design and system architectures, end-to-end link modelling and simulation
  • optical waveguide, substrate guided, lay-in fiber and free space optical interconnects
  • machine-to-machine, board-to-board, chip-to-chip, intra-chip optical interconnects
  • optical waveguide hybridization techniques for electronic/photonic integration
  • trends in ultra-short reach optical links.
Nanophotonics for optical interconnects
  • Si, Ge, SiGe, III-V devices and integration
  • small size and low loss waveguide-based active and passive devices
  • advances in chip-to-waveguide or chip-to-fibre coupling schemes including: grating coupler, adiabatic taper and butt-coupling approaches
  • subwavelength gratings for on-chip interconnect applications
  • 2D membrane based devices
  • photonic crystals and surface plasmonic waveguides for interconnect applications
  • new regimes involving surface plasmons or optical polaritons
  • implementation of optical interconnects in Si CMOS process compatible environment
  • measurement and testing methods for hybrid electronic/photonic assemblies
  • reliability assessment of optical interconnects, sub-systems and electronic/photonic assemblies.
Parallel optical links and active optical cables
  • data communication systems with parallel optical links and active optical cables
  • integration and packaging technologies for parallel on-board transceivers
  • parallel optical engines for on-board data communication
  • optical bus architectures for on-board interconnects
  • ultra-low cost optical links - innovations to achieve <$0.1/Gb/s for entire optical link
  • ultra-low power optical links
  • novel laser and photodiode array components for interconnect applications
  • assembly and alignment of arrayed components
  • free space parallel optical interconnect.
Optical communication in modern data centers
  • optical interconnect solutions for rack- and enclosure scale disaggregation
  • optically enabled hyperconverged infrastructures
  • multi-tier optical connectivity
  • WDM switching technologies and architectures for intra-data center interconnections
  • parallel optics for data center optical interconnects: inter-rack, inter-board and inter-chip designs.
Micro-optic and photonic packaging technologies
  • micro-optic component assemblies and integrated micro-optics
  • heterogeneous and monolithic device integration including silicon photonics
  • 3D optical routing and assembly of coupling elements
  • new connectors and novel light coupling approaches
  • prototyping for advanced interconnect fabrication
  • processing and connectorization of optical fibers
  • reflective, refractive and diffractive micro-optic elements and micro-optical systems
  • active optical alignment and assembly automation
  • passive micro-optic alignment techniques
  • interconnect reliability, qualification and test.
Materials for packaging and interconnects
  • advanced photonics packaging materials
  • thin glass for board, modules and panel-level-packaging
  • polymers and organic/inorganic hybrid materials for optical interconnects
  • graphene-based and transitional metal dichalcogenide membrane-based novel nanostructures
  • AuSn bonding for flip-chip with highest precision
  • polymer optical fibers
  • mid infrared fibers
  • structured fibers, multicore fibers
  • nanomaterials and applications
  • novel bonding materials and processes.
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