The Moscone Center
San Francisco, California, United States
7 - 12 February 2015
Conference 9368
Optical Interconnects XV
Monday - Wednesday 9 - 11 February 2015
This conference is no longer accepting submissions.
Late submissions may be considered subject to chair approval. For more information, please contact SPIE
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Abstract Due:
28 July 2014

Author Notification:
6 October 2014

Manuscript Due Date:
19 January 2015

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Conference Chairs
  • Henning Schröder, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (Germany)
  • Ray T. Chen, The Univ. of Texas at Austin (United States)

Program Committee
Program Committee continued...
Call for
Papers are solicited in the following areas:

Optical interconnect technologies
  • optical interconnect system architectures
  • board-to-board, chip-to-chip, intra-chip optical interconnects
  • ultra-short reach optical interconnects
  • datacenter photonics
  • waveguide, substrate guided, lay-in fiber and free space optical interconnects
  • new architectures and trends in ultra-short reach optical links.
Nanophotonics for optical interconnects
  • Si, Ge, SiGe, III-V devices and integration
  • waveguide-based active and passive devices
  • photonic crystals for interconnect applications
  • plasmonic devices
  • implementation of optical interconnects in Si CMOS process compatible environment
  • nanoscale fabrication technologies.
Parallel optical links and active optical cables
  • communication systems with parallel optical links and active optical cables
  • integration and packaging technologies for parallel transceivers and optical cables
  • parallel optical links for on-board data communication
  • optical bus architectures for on-board interconnects
  • ultra-low power optical links
  • laser and photodiode arrays for interconnect applications
  • assembly and alignment of arrayed components.
Micro-optic and photonic packaging technologies
  • assembly and embedded components
  • hybrid and monolithic device integration including silicon photonics
  • 3D optical routing and assembly
  • connectors and light coupling approaches
  • advanced interconnect fabrication and processing technologies including fiber optics
  • refractive and diffractive micro-optic elements micro-optic systems and integrated micro-optics
  • active optical alignment and attachment automation
  • passive micro-optic alignment methods.
Materials for packaging and interconnects
  • advanced photonics packaging materials
  • polymers for integrated optics and interconnects
  • polymer optical fibers (POF)
  • mid infra-red fibers
  • nanomaterials and applications.
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