The Moscone Center
San Francisco, California, United States
27 January - 1 February 2018
Conference OE111
Smart Photonic and Optoelectronic Integrated Circuits XX
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Abstract Due:
17 July 2017

Author Notification:
25 September 2017

Manuscript Due Date:
3 January 2018

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Conference Chairs
Program Committee
Program Committee continued...
  • Joachim Piprek, NUSOD Institute LLC (United States)
  • David V. Plant, McGill Univ. (Canada)
  • Andrew W. Poon, Hong Kong Univ. of Science and Technology (Hong Kong, China)
  • Ali Serpengüzel, Koç Univ. (Turkey)
  • Qian Wang, A*STAR - Data Storage Institute (Singapore)
  • Michael R. Watts, Massachusetts Institute of Technology (United States)
  • Lin Yang, Institute of Semiconductors (China)
  • Rui Q. Yang, The Univ. of Oklahoma (United States)

Call for
Papers are solicited in the area of optical or photonic integrated circuits (PICs) and optoelectronic integrated circuits (OEICs) for smart or intelligent systems. Optical, photonic, optoelectronic, electronic, and/or biological devices are integrated to address the issues of functionality, performance, reliability, space and cost in an increasingly complex and connected world with dynamic environments that can benefit from smart solutions comprising integrated micro- or nanoscale circuits with possible artificial intelligence.

Demands for greater bandwidths have driven the telecom and datacom research and development communities to realize complex optoelectronic integrated circuits such as transceivers, switching systems, low chirp optical sources, and multichannel optical distribution systems. The integration of multi-wavelength laser arrays, monitoring photodiodes, and drivers is becoming a reality in the communications arena. Other emerging fields include 3D time of flight (TOF) sensing/scanning, real-time 3D imaging/mapping, 3D printing, holographic displays, smart pixel arrays, neural networks, optical computing, optical data storage, medical diagnostics, chemical/biological sensing, and object detection, tracking, identification, and classification.

The increased level of integration in recent years has resulted in an increased level of miniaturization. The scientific and technological issues and challenges concerning the micro/nano/quantum-scale integration of optoelectronic devices, circuits, and systems include the size effect, proximity effect, energy confinement effect, microcavity effect, single photon effect, optical interference effect, high field effect, noise effect, quantum optical effect, nonlinear effects, and chaotic noise effects. Optical alignment between miniature devices, minimizing interconnection losses, and maintaining optical modes between devices, are important issues and require careful consideration. Scientists and engineers from academic institutions, research laboratories, and the industry are strongly encouraged to submit papers in the following areas:
  • physics, theory, design, modeling, simulation, and scaling of photonic integrated circuits (PICs) and optoelectronic integrated circuits (OEICs)
  • PIC/OEIC materials (semiconductors, graphene, glasses, polymers, ferroelectrics, magnetics, metals, biomaterials, DNA, molecules, etc.)
  • integration, interconnection, fabrication, assembly, packaging, characterization, and roadmap of micro/nano silicon and compound semiconductor photonic and optoelectronic devices
  • electronics and photonics convergence on a silicon CMOS platform
  • integration of different photonic and optoelectronic structure types (dots, wires, wells, planar, free space, 1D/2D/3D photonic bandgap devices, plasmonic devices, etc.)
  • integration of miniature (micro/nano/quantum-scale) photonic and optoelectronic devices, circuits, and systems; photonic/optoelectronic system on a chip; VLSI/ULSI photonics and optoelectronics
  • integration of novel devices using micro-rings, micro-disks, micro-spheres, micro-cavities, nano-optic/nano-photonic devices, nano-lasers, nano-detectors, nano-wires, plasmonics, and metamaterials
  • integration and assembly of micro- and nano-scale imaging systems
  • integration and assembly of micro- and nano-scale smart sensor and detector systems
  • miniaturization and integration of THz and microwave photonic devices, components, and systems
  • integration and interconnection of different functions (lasers, amplifiers, detectors, sensors, modulators, isolators, circulators, switches, attenuators, couplers, phased arrays, multi/demultiplexers, filters, wavelength converters, polarization controllers, PMD/CD compensators, control electronics, etc.)
  • integration of dynamic devices actuated through thermo-optic, electro-optic, acousto-optic, magneto-optic, and all-optical mechanisms
  • monolithic and hybrid integration of optical, photonic, optoelectronic, electronic, and biological devices
  • parallel and serial integration of optical, photonic, and optoelectronic devices
  • fabrication and processing techniques (UV/deep UV/X-ray/e-beam lithography, casting, molding, embossing, etching, passivation, etc.)
  • alignment, tolerance, coupling, and interconnections; designs for alignment tolerance relaxation
  • optical interconnection and integration on photonic PCBs
  • integration on novel flexible and rigid substrates
  • assembly and packaging approaches and processes
  • characterization (optical, electrical, optoelectronic, thermal, structural, etc.)
  • standards, quality, reliability, qualification, and certification
  • components, modules, subsystems, and systems
  • smart PIC- and OEIC-based systems with artificial intelligence
  • smart systems of special interest include nodes in self-healing optical communication networks, light detection and ranging (LiDAR) sensing systems with object detection, tracking, identification, and classification capability
  • applications: communications, quantum information services, computing, data storage, sensing, scanning, imaging, mapping, displays, printing, industrial automation, robotization, autonomous vehicles, etc.
  • subsystem-on-chip for bio-detection, sensing and communications.
Refinement of existing schemes as well as novel concepts are within the scope of this solicitation. Authors are also encouraged to emphasize design-for-manufacturing criteria and manufacturing methods that enable the commercial deployment of PIC- and OEIC-based smart systems.
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