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Proceedings Paper
Ke Du, Meiliana Siauw, David Valade, The Univ. of Queensland (Australia); Marek Jasieniak, Nico Voelcker, Univ. of South Australia (Australia); Peter Trefonas III, Jim Thackeray, Dow Electronic Materials (United States); Idriss Blakey, Andrew Whittaker, The Univ. of Queensland (Australia)
Published in Proceedings Volume 10146: Advances in Patterning Materials and Processes XXXIV
May 2017 View Abstract

Video
Smaller feature sizes and increasing density have been the result of innovative chemical solutions to enable lithography advances, says Dow Corporate Fellow.
Proceedings Paper
Meiliana Siauw, Ke Du, David Valade, The Univ. of Queensland (Australia); Peter Trefonas, James W. Thackeray, Dow Electronic Materials (United States); Andrew Whittaker, Idriss Blakey, The Univ. of Queensland (Australia)
Published in Proceedings Volume 9779: Advances in Patterning Materials and Processes XXXIII
June 2016 View Abstract

Proceedings Paper
Cong Liu, Kevin Rowell, Lori Joesten, Paul Baranowski, Irvinder Kaur, Wanyi Huang, JoAnne Leonard, Hae-Mi Jeong, Kwang-Hwyi Im, Tom Estelle, Charlotte Cutler, Gerd Pohlers, Wenyan Yin, Patricia Fallon, Mingqi Li, Hyun Jeon, Cheng Bai Xu, Pete Trefonas, The Dow Chemical Co. (United States)
Published in Proceedings Volume 9779: Advances in Patterning Materials and Processes XXXIII
June 2016 View Abstract

Proceedings Paper
Shintaro Yamada, Deyan Wang, Vivian Chuang, Cong Liu, Sabrina Wong, Michael B. Clark, Charlotte Cutler, William Williams, Paul Baranowski, Mingqi Li, Joe Mattia, JoAnne Leonard, Peter Trefonas, Kathleen O’Connell, Cheng bai Xu, The Dow Chemical Co. (United States)
Published in Proceedings Volume 9425: Advances in Patterning Materials and Processes XXXII
April 2015 View Abstract

Proceedings Paper
Dan B. Millward, Gurpreet S. Lugani, Scott L. Light, Micron Technology, Inc. (United States); Ardavan Niroomand, Micron Technology, Inc. (Belgium); Phillip D. Hustad, Peter Trefonas, Dung Quach, Dow Electronic Materials (United States); Valeriy V. Ginzburg, The Dow Chemical Co. (United States)
Published in Proceedings Volume 9423: Alternative Lithographic Technologies VII
April 2015 View Abstract

Proceedings Paper
Dung Quach, Dow Electronic Materials (United States); Valeriy V. Ginzburg, The Dow Chemical Co. (United States); Mingqi Li, Janet Wu, Shih-wei Chang, Peter Trefonas III, Phillip D. Hustad, Dow Electronic Materials (United States); Dan B. Millward, Gurpreet S. Lugani, Scott L. Light, Micron Technology, Inc. (United States)
Published in Proceedings Volume 9423: Alternative Lithographic Technologies VII
April 2015 View Abstract

Proceedings Paper
Kenneth L. Kearns, The Dow Chemical Co. (United States); Hong-Yeop Na, The Dow Seoul Technology Ctr. (Korea, Republic of); Robert D. Froese, Sukrit Mukhopadhyay, Hunter Woodward, Dean Welsh, Timothy De Vries, David Devore, The Dow Chemical Co. (United States); Peter Trefonas, Dow Electronic Materials (United States); Liang Hong, Dow Elastomers, Electrical and Telecommunications (United States)
Published in Proceedings Volume 9183: Organic Light Emitting Materials and Devices XVIII
October 2014 View Abstract

Proceedings Paper
Dan B. Millward, Gurpreet S. Lugani, Ranjan Khurana, Scott L. Light, Micron Technology, Inc. (United States); Ardavan Niroomand, Micron Technology, Inc. (Belgium); Philip D. Hustad, Peter Trefonas, Shih-wei Chang, Christopher N. Lee, Dung Quach, Dow Electronic Materials (United States)
Published in Proceedings Volume 9054: Advanced Etch Technology for Nanopatterning III
April 2014 View Abstract

Proceedings Paper
Jieqian Zhang, Janet Wu, Mingqi Li, Dow Electronic Materials (United States); Valeriy V. Ginzburg, Jeffrey D. Weinhold, Michael B. Clark, The Dow Chemical Co. (United States); Peter Trefonas III, Phillip D. Hustad, Dow Electronic Materials (United States)
Published in Proceedings Volume 9051: Advances in Patterning Materials and Processes XXXI
April 2014 View Abstract

Conferences + Exhibitions
SPIE Advanced Lithography event photos
JM3 - Journal of Micro/Nanolithography, MEMS, and MOEMS Paper
Peter Trefonas III, James W. Thackeray, Guorong Sun, Sangho Cho, Corrie Clark, Stanislav V. Verkhoturov, Michael J. Eller, Ang Li, Adriana Pavia-Sanders, Emile A. Schweikert, Karen L. Wooley
Published in Volume 12, Issue 04
October 2013 11 pages View Abstract

Proceedings Paper
Peter Trefonas, James W. Thackeray, Dow Electronic Materials Co. (United States); Guorong Sun, Sangho Cho, Corrie Clark, Stanislav V. Verkhoturov, Michael J. Eller, Ang Li, Adriana Pavía-Jiménez, Emile A. Schweikert, Karen L. Wooley, Texas A&M Univ. (United States)
April 2013 View Abstract

Proceedings Paper
Tsung Ju Yeh, Lian Cong Liu, Yeh-Sheng Lin, Wei-Sheng Chen, Che-Yi Lin, Chia Hung Lin, Chun Chi Yu, United Microelectronics Corp. (Taiwan); Deyan Wang, Mingqi Li, Chunfeng Guo, Rick Hardy, Tom Estelle, Chengbai Xu, George Barclay, Peter Trefonas, Kathleen O'Connell, The Dow Chemical Co. (United States)
April 2013 View Abstract

Proceedings Paper
Shih-wei Chang, Dow Electronic Materials (United States); Jessica P. Evans, Shouren Ge, Valeriy V. Ginzburg, John W. Kramer, Brian Landes, The Dow Chemical Co. (United States); Christopher Lee, Dow Electronic Materials (United States); Greg F. Meyers, Daniel J. Murray, The Dow Chemical Co. (United States); Jong Park, Dow Electronic Materials (United States); Rahul Sharma, The Dow Chemical Co. (United States); Peter Trefonas III, Dow Electronic Materials (United States); Jeffrey D. Weinhold, The Dow Chemical Co. (United States); Jieqian Zhang, Phillip D. Hustad, Dow Electronic Materials (United States)
Published in Proceedings Volume 8680: Alternative Lithographic Technologies V
April 2013 View Abstract

Proceedings Paper
Deyan Wang, Jinrong Liu, Doris Kang, Cong Liu, Tom Estelle, Cheng-Bai Xu, George Barclay, Peter Trefonas, The Dow Chemical Co. (United States)
April 2012 View Abstract

Proceedings Paper
Shih-Wei Chang, Dow Electronic Materials (United States); Erin E. Vogel, Valeriy V. Ginzburg, Daniel J. Murray, John W. Kramer, Jeffrey D. Weinhold, The Dow Chemical Co. (United States); Vivian P. W. Chuang, Dow Electronic Materials (United States); Rahul Sharma, Jessica P. Evans, Brian Landes, Shouren Ge, The Dow Chemical Co. (United States); Peter Trefonas III, Dow Electronic Materials (United States); Phillip D. Hustad, The Dow Chemical Co. (United States)
Published in Proceedings Volume 8323: Alternative Lithographic Technologies IV
April 2012 View Abstract

Proceedings Paper
Andreas Erdmann, Feng Shao, Fraunhofer Institute for Integrated Systems and Device Technology (Germany); Juergen Fuhrmann, Andre Fiebach, Weierstrass Institute for Applied Analysis and Stochastics (Germany); George P. Patsis, Institute of Microelectronics (Greece); Peter Trefonas, Dow Electronic Materials (United States)
Published in Proceedings Volume 7640: Optical Microlithography XXIII
March 2010 View Abstract

Proceedings Paper
Young C. Bae, Yi Liu, Thomas Cardolaccia, Ken Spizuoco, Rosemary Bell, Lori Joesten, Amandine Pikon, Michael Reilly, Sheri Ablaza, Peter Trefonas, George G. Barclay, The Dow Chemical Co. (United States)
Published in Proceedings Volume 7520: Lithography Asia 2009
December 2009 View Abstract

Proceedings Paper
Young C. Bae, Yi Liu, Thomas Cardolaccia, John C. McDermott, Peter Trefonas, Ken Spizuoco, Michael Reilly, Amandine Pikon, Lori Joesten, Gary G. Zhang, George G. Barclay, Rohm and Haas Electronic Materials (United States); Julia Simon, Stéphanie Gaurigan, Commissariat à l'Energie Atomique (France)
March 2009 View Abstract

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