San Jose Marriott and San Jose Convention Center
San Jose, California, United States
26 February - 2 March 2017
Conference 10145
Metrology, Inspection, and Process Control for Microlithography XXXI
Monday - Thursday 27 February - 2 March 2017
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Conference Chair
Martha I. Sanchez
IBM Research - Almaden




Conference Co-Chair
Vladimir A. Ukraintsev
QORVOTM
Monday 27 February Show All Abstracts
Opening Remarks and Award Presentation
Monday 27 February 2017
11:00 AM - 11:10 AM
Location: Convention Center 220B

Chair: Martha I. Sanchez, IBM Research - Almaden (USA)

Presentation of the 2016 Diana Nyyssonen Memorial Best Paper Award in Metrology


Award Sponsored by
Session 1:
Keynote Session
Monday 27 February 2017
11:10 AM - 12:10 PM
Location: Convention Center 220B
Session Chairs:
Martha I. Sanchez, IBM Research - Almaden (United States) ;
Vladimir A. Ukraintsev, Qorvo, Inc. (United States)
Advancing measurement science at NIST to enable atom-scale technology (Keynote Presentation)
Paper 10145-1
Time: 11:10 AM - 11:40 AM
Author(s): Richard M. Silver, Bryan M. Barnes, Andrew Herzing, R. Joseph Kline, National Institute of Standards and Technology (United States); Frederick Meisenkothen, National Institite of Standards and Technology (United States); Ndubuisi G. Orji, András E. Vladár, National Institute of Standards and Technology (United States)
Show Abstract
Metrology challenges for in-line process control (Keynote Presentation)
Paper 10145-2
Time: 11:40 AM - 12:10 PM
Author(s): Philippe Leray, IMEC (Belgium)
Show Abstract
Lunch Break 12:10 PM - 1:40 PM
Session 2:
Hybrid Metrology
Monday 27 February 2017
1:40 PM - 3:20 PM
Location: Convention Center 220B
Session Chairs:
Alok Vaid, GLOBALFOUNDRIES Inc. (United States) ;
Narender Rana, Western Digital Corp. (United States)
Electrical test prediction using hybrid metrology and machine learning
Paper 10145-3
Time: 1:40 PM - 2:00 PM
Author(s): Mary Breton, Robin Chao, Gangadhara Raja Muthinti, Abraham A. de la Pena, Jacques Simon, IBM Corp. (United States); Aron J. Ceplar, Matthew J. Sendelbach, Nova Measuring Instruments Inc. (United States); John Gaudiello, IBM Corp. (United States); Susan Emans, Nova Measuring Instruments Inc. (United States); Michael Shifrin, Yoav Etzioni, Ronen Urenski, Nova Measuring Instruments Ltd. (Israel); Wei Ti Lee, ReVera, Inc. (United States)
Show Abstract
Patterning control strategies for minimum edge placement error in logic devices
Paper 10145-4
Time: 2:00 PM - 2:20 PM
Author(s): Jan Mulkens, ASML Netherlands B.V. (Netherlands); Michael Hanna, ASML USA (United States); Bram Slachter, Wim Tel, Michael Kubis, Mark Maslow, ASML Netherlands B.V. (Netherlands); Chris Spence, ASML USA (United States); Vadim Timoshkov, ASML Netherlands B.V. (Netherlands)
Show Abstract
Hybrid scatterometry measurement for BEOL process control
Paper 10145-5
Time: 2:20 PM - 2:40 PM
Author(s): Padraig R. Timoney, Alok Vaid, GLOBALFOUNDRIES Inc. (United States); Byeong Cheol Kang, Nova Measuring Instruments Ltd. (United States); Haibo Liu, Paul K. Isbester, Marjorie Cheng, Nova Measuring Instruments Inc. (United States); Susan Ng-Emans, Nova Measuring Instruments (United States); Naren Yellai, Matthew J. Sendelbach, Nova Measuring Instruments Inc. (United States); Roy Koret, Oram Gedalia, Nova Measuring Instruments Ltd. (Israel)
Show Abstract
The coming of age of the first hybrid metrology software platform dedicated to nanotechnologies (Conference Presentation)
Paper 10145-6
Time: 2:40 PM - 3:00 PM
Author(s): Johann Foucher, Aurelien Labrosse, Alexandre Dervillé, Yann Zimmermann, Guilhem Bernard, Sergio Martinez, Hanna Grönqvist, Julien Baderot, Florian Pinzan, POLLEN Metrology (France)
Show Abstract
A hybrid solution using computational prediction and measured data to accurately determine process corrections with reduced overlay sampling
Paper 10145-7
Time: 3:00 PM - 3:20 PM
Author(s): Ben F. Noyes, Babak Mokaberi, Ram Mandoy, Alex Pate, SAMSUNG Austin Semiconductor LLC (United States); Ralph T. Huijgen, ASML Netherlands B.V. (Netherlands); Michael S. McBurney, ASML Austin (United States); Owen Chen, ASML Netherlands B.V. (Netherlands)
Show Abstract
Coffee Break 3:20 PM - 3:50 PM
Session 3:
Overlay
Monday 27 February 2017
3:50 PM - 6:20 PM
Location: Convention Center 220B
Session Chairs:
Alexander Starikov, I&I Consulting (United States) ;
Hugo Cramer, ASML Netherlands B.V. (Netherlands)
Impact of stochastic process variations on overlay mark fidelity "towards the 5nm node" (Invited Paper)
Paper 10145-8
Time: 3:50 PM - 4:20 PM
Author(s): Michael E. Adel, KLA-Tencor Israel (Israel); Roel Gronheid, KLA-Tencor Belgium (Belgium); Chris A. Mack, Lithoguru.com (United States); Philippe Leray, IMEC (Belgium); Evgeni Gurevich, KLA-Tencor Israel (Israel); Bart Baudemprez, Dieter Vandenheuvel, imec (Belgium); Antonio Mani, KLA-Tencor Belgium (Belgium); Sharon Aharon, Dana Klein, KLA-Tencor Israel (Israel); Jungtae Lee, KLA-Tencor (Korea, Democratic Peoples Republic of); Mark D. Smith, KLA-Tencor Corp. (United States)
Show Abstract
A complete methodology towards accuracy and lot-to-lot robustness in on-product overlay metrology using flexible wavelength selection
Paper 10145-9
Time: 4:20 PM - 4:40 PM
Author(s): Kaustuve Bhattacharyya, Arie den Boef, Marc Noot, Omer Adam, Grzegorz Grzela, Andreas Fuchs, Martin Jak, Sax Liao, Ken Chang, ASML Netherlands B.V. (Netherlands); Vincent Couraudon, ASML Netherlands B.V. (Taiwan); Eason Su, Wilson Tzeng, Cathy Wang, Christophe Fouquet, ASML Netherlands B.V. (Netherlands); Guo-Tsai Huang, Kai-Hsiung Chen, YC Wang, Kevin Cheng, Chih-Ming Ke, L. G. Terng, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Show Abstract
Reaching for the true overlay in advanced nodes
Paper 10145-10
Time: 4:40 PM - 5:00 PM
Author(s): Chiew-Seng Koay, Bassem Hamieh, Nelson Felix, John Gaudiello, IBM Corp. (United States)
Show Abstract
Image based overlay measurement improvements of 28nm FD-SOI CMOS front-end critical steps
Paper 10145-11
Time: 5:00 PM - 5:20 PM
Author(s): Florent Dettoni, STMicroelectronics (France); Tetyana Shapoval, KLA-Tencor Germany (Germany); Régis Bouyssou, STMicroelectronics (France); Tal Itzkovich, KLA-Tencor Israel (Israel); Ronny Haupt, KLA-Tencor Germany (Germany); Christophe Dezauzier, STMicroelectronics (France)
Show Abstract
Spectral tunability matters
Paper 10145-114
Time: 5:20 PM - 5:40 PM
Author(s): Eran Amit, Ido Adam, Yuval Lamhot, Einat Peled, KLA-Tencor Israel (Israel)
Show Abstract
High-volume manufacturing device overlay process control
Paper 10145-13
Time: 5:40 PM - 6:00 PM
Author(s): Honggoo Lee, Sangjun Han, Jaeson Woo, DongYoung Lee, ChangRock Song, SK Hynix, Inc. (Korea, Republic of); Hoyoung Heo, Irina Brinster, DongSub Choi, John C. Robinson, KLA-Tencor Texas (United States)
Show Abstract
In-depth analysis of indirect overlay method and applying in production environment
Paper 10145-14
Time: 6:00 PM - 6:20 PM
Author(s): Detlef Hofmann, Infineon Technologies Dresden (Germany); Frank Rabe, Infineon Dresden GmbH (Germany); Stefan Buhl, Wan-Soo Kim, Boris Habets, Qoniac GmbH (Germany)
Show Abstract
Tuesday 28 February Show All Abstracts
Session 4:
Future
Tuesday 28 February 2017
8:00 AM - 10:10 AM
Location: Convention Center 220B
Session Chairs:
Richard M. Silver, National Institute of Standards and Technology (United States) ;
Masafumi Asano, Toshiba Corp. (Japan)
Metrology capabilities and needs for 7nm and 5nm logic nodes (Invited Paper)
Paper 10145-15
Time: 8:00 AM - 8:30 AM
Author(s): Benjamin D. Bunday, Eric Solecky, Alok Vaid, Abner F. Bello, Xintuo Dai, GLOBALFOUNDRIES Inc. (United States)
Show Abstract
Variability study with CD-SEM metrology for STT-MRAM: correlation analysis between physical dimensions and electrical property of the memory element
Paper 10145-16
Time: 8:30 AM - 8:50 AM
Author(s): Takeyoshi Ohashi, Atsuko Yamaguchi, Hitachi, Ltd. (Japan); Kazuhisa Hasumi, Osamu Inoue, Masami Ikota, Hitachi High-Technologies Corp. (Japan); Gian F. Lorusso, Gabriele L. Donadio, Farrukh Q. Yasin, Siddharth Rao, Gouri S. Kar, IMEC (Belgium)
Show Abstract
Designed tools for analysis of lithography patterns and nanostructures
Paper 10145-17
Time: 8:50 AM - 9:10 AM
Author(s): Alexandre Dervilllé, POLLEN Metrology (France), Univ. Grenoble Alpes (France); Julien Baderot, Guilhem Bernard, Johann Foucher, Hanna Grönqvist, Aurelien Labrosse, Sergio Martinez, Yann Zimmermann, POLLEN Metrology (France)
Show Abstract
Required metrology and inspection for nanoimprint lithography
Paper 10145-18
Time: 9:10 AM - 9:30 AM
Author(s): Masafumi Asano, Hideaki Abe, Kazuto Matsuki, Ryoji Yoshikawa, Motofumi Komori, Takashi Hirano, Shinji Mikami, Toshiba Corp. (Japan); Yongho Kim, Eunhyuk Choi, Woo-Yung Jung, SK Hynix, Inc. (Korea, Republic of)
Show Abstract
Sub-wavelength transmission and reflection mode tabletop imaging with 13nm illumination via ptychography CDI
Paper 10145-113
Time: 9:30 AM - 9:50 AM
Author(s): Michael Tanksalvala, Univ. of Colorado Boulder (United States); Christina L. Porter, Dennis Floyd Gardner, JILA (United States); Michael Gerrity, JILA, University of Colorado at Boulder (United States); Giulia F. Mancini, JILA (United States); Xiaoshi Zhang, Kapteyn-Murnane Labs., Inc. (United States); Galen P. Miley, Northwestern Univ. (United States); Elisabeth R. Shanblatt, Univ. of Colorado Boulder (United States); Benjamin R. Galloway, Charles Bevis, JILA, University of Colorado at Boulder (United States); Robert Karl, JILA (United States); Daniel E. Adams, JILA, University of Colorado at Boulder (United States); Henry C. Kapteyn, JILA (United States); Margaret M. Murnane, JILA, University of Colorado at Boulder (United States)
Show Abstract
High-throughput electrical characterization for robust overlay lithography control
Paper 10145-85
Time: 9:50 AM - 10:10 AM
Author(s): Devender Devender, GLOBALFOUNDRIES Inc. (United States); Xumin Shen, PDF Solutions, Inc. (United States); Mark Duggan, Sunil Singh, GLOBALFOUNDRIES Inc. (United States); Jonathan Rullan, Jae Choo, GLOBALFOUNDRIES (United States); Sohan S. Mehta, Teck Jung Tang, Sean G. Reidy, GLOBALFOUNDRIES Inc. (United States); Jonathan Holt, GLOBALFOUNDRIES Inc. (United States), PDF Solutions, Inc. (United States); Hyung Woo Kim, Robert Fox, GLOBALFOUNDRIES Inc. (United States); DK Sohn, GLOBALFOUNDRIES (United States)
Show Abstract
Coffee Break 10:10 AM - 10:40 AM
Session 5:
EUV Mask Inspection and Imaging: Joint Session with Conferences 10143 and 10145
Tuesday 28 February 2017
10:40 AM - 12:00 PM
Location: Convention Center 220A
Session Chairs:
Anna Tchikoulaeva, Lasertec U.S.A., Inc. Zweigniederlassung Deutschland (Germany) ;
Ofer Adan, Applied Materials, Ltd. (Israel)
Actinic review of EUV masks: performance data and status of the AIMS EUV system
Paper 10143-15
Time: 10:40 AM - 11:00 AM
Author(s): Dirk Hellweg, Markus Koch, Sascha Perlitz, Martin Dietzel, Renzo Capelli, Carl Zeiss SMT GmbH (Germany)
Show Abstract
Application of actinic mask review system for the preparation of HVM EUV lithography with defect free mask
Paper 10145-21
Time: 11:00 AM - 11:20 AM
Author(s): Ji Hoon Na, Donggun Lee, Changhwan Do, Hong-Seok Sim, Jung-Hwan Lee, SAMSUNG Electronics Co., Ltd. (Korea, Republic of); Jungyoup Kim, Hwan-Seok Seo, SAMSUNG Electronics Co Ltd (Korea, Republic of); Heebom Kim, Chan-uk Jeon, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Show Abstract
Printability and actinic AIMS review of programmed mask blank defects
Paper 10143-16
Time: 11:20 AM - 11:40 AM
Author(s): Erik Verduijn, Pawitter Mangat, Obert R. Wood, Jed H. Rankin, Yulu Chen, Francis Goodwin, GLOBALFOUNDRIES Inc. (United States); Renzo Capelli, Sascha Perlitz, Dirk Hellweg, Carl Zeiss SMT GmbH (Germany); Ravi K. Bonam, Shravan Matham, Nelson M. Felix, Daniel A. Corliss, IBM Corp. (United States)
Show Abstract
Towards a stand-alone high-throughput EUV actinic photomask inspection tool: RESCAN
Paper 10145-22
Time: 11:40 AM - 12:00 PM
Author(s): Rajeev Rajendran, Paul Scherrer Institute, ETH Zürich (Switzerland); Iacopo Mochi, Patrick Helfenstein, Istvan Mohasci, Sophie Redford, Aldo Mozzanica, Bernd Schmitt, Paul Scherrer Institute (Switzerland); Shushuke Yoshitake, Nuflare Technology Inc. (Japan); Yasin Ekinci, Paul Scherrer Institute (Switzerland)
Show Abstract
Lunch/Exhibition Break 12:00 PM - 1:30 PM
Session 6:
Wafer-Shape Induced Overlay
Tuesday 28 February 2017
1:30 PM - 2:30 PM
Location: Convention Center 220B
Session Chairs:
Shunsuke Koshihara, Hitachi High-Technologies Corp. (Japan) ;
Christopher J. Raymond, Nanometrics Inc. (United States)
Patterned wafer geometry grouping for improved overlay control
Paper 10145-23
Time: 1:30 PM - 1:50 PM
Author(s): Honggoo Lee, Sangjun Han, Jaeson Woo, Junbeom Park, Changrock Song, SK Hynix, Inc. (Korea, Republic of); Fatima Anis, Pradeep Vukkadala, Sanghuck Jeon, DongSub Choi, Kevin Huang, Hoyoung Heo, Mark D. Smith, KLA-Tencor Texas (United States); John C. Robinson, KLA-Tencor Corp. (United States)
Show Abstract
Wafer-shape metrics based foundry lithography
Paper 10145-24
Time: 1:50 PM - 2:10 PM
Author(s): Sungtae Kim, Ultratech, Inc. (Korea, Republic of); Frida Liang, Ultratech, Inc. (Taiwan); Jeffrey Mileham, Ultratech, Inc. (United States); Damon Tsai, Ultratech, Inc. (Taiwan); Eric Bouche, Ultratech, Inc. (United States); Sean Lee, Albert Huang, Chi Feng Hua, Ming Sheng Wei, United Microelectronics Corp. (Taiwan)
Show Abstract
Topography based wafer clustering for wafer level overlay correction
Paper 10145-26
Time: 2:10 PM - 2:30 PM
Author(s): Honggoo Lee, Sangjun Han, SK Hynix, Inc. (Korea, Republic of); Heongsoo Kim, SK Hynix R3 (Korea, Republic of); Boris Habets, Enrico Bellmann, Steven Tottewitz, Stefan Buhl, Martin Rössiger, Qoniac GmbH (Germany); Seop Kim, Qoniac Korea Co., Ltd. (Korea, Republic of)
Show Abstract
Session 7:
Process Control
Tuesday 28 February 2017
2:30 PM - 5:30 PM
Location: Convention Center 220B
Session Chairs:
Timothy F. Crimmins, Intel Corp. (United States) ;
Matthew J. Sendelbach, Nova Measuring Instruments Inc. (United States)
In-line E-beam metrology and defect inspection: industry reflections, hybrid E-beam opportunities, recommendations and predictions (Invited Paper)
Paper 10145-27
Time: 2:30 PM - 3:00 PM
Author(s): Eric Solecky, Allen Rasafer, Jason R. Cantone, Benjamin D. Bunday, Alok Vaid, Oliver D. Patterson, Andrew Stamper, Kevin Wu, Ralf Buengener, GLOBALFOUNDRIES Inc. (United States); Weihao Wang, Xintuo Dai, GLOBALFOUNDRIES Inc (United States)
Show Abstract
Smart sampling for process control
Paper 10145-28
Time: 3:00 PM - 3:20 PM
Author(s): Jeffrey Weintraub, Scott Warrick, Cirrus Logic, Inc. (United States)
Show Abstract
Coffee Break 3:20 PM - 3:50 PM
A new method for wafer quality monitoring using semiconductor process big data
Paper 10145-29
Time: 3:50 PM - 4:10 PM
Author(s): Younghoon Sohn, Hyun Lee, Yusin Yang, ChungSam Jun, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Show Abstract
Combined process window monitoring for critical features
Paper 10145-30
Time: 4:10 PM - 4:30 PM
Author(s): Carsten Hartig, Bernd Schulz, Robert Melzer, Matthias Ruhm, Daniel Fischer, GLOBALFOUNDRIES Dresden Module One LLC & Co. KG (Germany); Stefan Buhl, Boris Habets, Martin Rössiger, Manuela Gutsch, Qoniac GmbH (Germany)
Show Abstract
Computational overlay metrology with adaptive data analytics
Paper 10145-31
Time: 4:30 PM - 4:50 PM
Author(s): Emil Schmitt-Weaver, ASML Netherlands B.V. (Netherlands); Venkatram Subramony, Md Zakir Ullah, Masazumi Matsunobu, Ravin Somasundaram, Joel Thomas, Linmiao Zhang, Klaus Thul, Micron Technology, Inc. (United States); Kaustuve Bhattacharyya, ASML Netherlands B.V. (Netherlands); Ronald J. G. Goossens, ASML US, Inc. (United States); Cees Lambregts, Wim Tel, Chris de Ruiter, ASML Netherlands B.V. (Netherlands)
Show Abstract
Surface topography analysis and performance on post-CMP images (Conference Presentation)
Paper 10145-32
Time: 4:50 PM - 5:10 PM
Author(s): Jusang Lee, Abner F. Bello, Shinichiro Kakita, GLOBALFOUNDRIES Inc. (United States); Nicholas Pieniazek, SUNY CNSE/SUNYIT (United States); Timothy A. Johnson, Nanometrics Inc. (United States)
Show Abstract
Advanced in-production hotspot prediction and monitoring with micro-topography
Paper 10145-33
Time: 5:10 PM - 5:30 PM
Author(s): Pierre M. Fanton, STMicroelectronics (France); Tanbir Hasan, ASML Brion (United States); Amine Lakcher, STMicroelectronics (France), Lab. des Technologies de la Microélectronique, Ctr. National de la Recherche Scientifique (France); Bertrand Le-Gratiet, STMicroelectronics (France); Christopher Prentice, ASML SARL (France); Jean Gabriel Simiz, STMicroelectronics (France); Raphael La Greca, Laurent Depre, ASML SARL (France); Stefan Hunsche, ASML Brion (United States)
Show Abstract
Session PWed:
Posters-Tuesday
Tuesday 28 February 2017
6:00 PM - 8:00 PM
Location: Convention Center Hall 2

The following posters will be on display from 10:00 am to 5:00 pm, and from 6:00 pm to 8:00 pm during the poster session. Come and view the high-quality papers that are presented in this alternative format, and interact with the poster authors who will be present during the poster session. Enjoy light refreshments while networking with your colleagues.

Full author or technical registration is required for entry to the poster sessions. Please wear your registration badge.
Overlay degradation induced by film stress
Paper 10145-71
Time: 6:00 PM - 8:00 PM
Author(s): Chi-hao Huang, Yu-Lin Liu, Shing-Ann Luo, Mars Yang, Elvis Yang, Yung-Tai Hung, Macronix International Co., Ltd. (Taiwan); Tuung Luoh, Macronix International Co. Ltd. (Taiwan); T. H. Yang, K. C. Chen, Macronix International Co., Ltd. (Taiwan)
Show Abstract
Normal and oblique incidence scatterometry for 2D/3D isolation mounts with RCWA and PML
Paper 10145-72
Time: 6:00 PM - 8:00 PM
Author(s): Hirokimi Shirasaki, Tamagawa Univ. (Japan)
Show Abstract
Failure analysis metrology of semiconductor device using inline conductive AFM
Paper 10145-73
Time: 6:00 PM - 8:00 PM
Author(s): ChaeHo Shin, Korea Research Institute of Standards and Science (Korea, Republic of)
Show Abstract
Adaptive filtering schemes for data estimation in process control for microlithography
Paper 10145-74
Time: 6:00 PM - 8:00 PM
Author(s):
Show Abstract
Scanning electron microscope automatic defect classification of process induced defects
Paper 10145-75
Time: 6:00 PM - 8:00 PM
Author(s): Scott Wolfe, SunEdison (United States); Steve A. McGarvey, Hitachi High Technologies America, Inc. (United States)
Show Abstract
Process resilient overlay target designs for advanced memory manufacture
Paper 10145-76
Time: 6:00 PM - 8:00 PM
Author(s): Joonseuk Lee, SK Hynix (Korea, Republic of); Mirim Jung, Honggoo Lee, Youngsik Kim, Sangjun Han, SK Hynix, Inc. (Korea, Republic of); Michael E. Adel, Tal Itzkovich, Vladimir B. Levinski, Victoria Naipak, Anna Golotsvan, Amnon Manassen, KLA-Tencor Israel (Israel); Yuri Paskover, Tom Leviant, Efi Megged, KLA Tencor (Israel); Myungjun Lee, Mark D. Smith, KLA-Tencor Corp. (United States); Do-Hwa Lee, DongSub Choi, Zephyr Liu, KLA-Tencor Korea (Korea, Republic of)
Show Abstract
Asymmetry overlay correction for lithography processes
Paper 10145-77
Time: 6:00 PM - 8:00 PM
Author(s): Ming-Jui Chen, Chun-Chi Yu, United Microelectronics Corporation (Taiwan); Tang Chun Weng, Ching-Hsu Chang, Charlie Chen, Chia Ching Lin, En Chuan Lio, United Microelectronics Corp. (Taiwan); Chia Hsiang Yu, Kernel System Corp. (Taiwan)
Show Abstract
Hybrid methodology for on-product focus control using CD and diffraction-based focus marks
Paper 10145-78
Time: 6:00 PM - 8:00 PM
Author(s): Ben F. Noyes, Alex Pate, Steve Zhou, SAMSUNG Austin Semiconductor LLC (United States); Marco J. A. van der Heijden, Kevin Park, Reza Sadat Gousheh, Ralph T. Huijgen, Michael S. McBurney, Francois van Loon, ASML Netherlands B.V. (Netherlands)
Show Abstract
Monitoring of 450mm copper seeding and plating process via dark field inspection haze
Paper 10145-79
Time: 6:00 PM - 8:00 PM
Author(s): Nithin Yathapu, Milo Tallon, Global 450 Consortium (G450C), SUNY CNSE/SUNYIT (United States); Justin Brown, Hitachi High Technologies America, Inc. (United States)
Show Abstract
Application of advanced diffraction based optical metrology overlay capabilities for high-volume manufacturing
Paper 10145-80
Time: 6:00 PM - 8:00 PM
Author(s): Kai-Hsiung Chen, Guo-Tsai Huang, Hung-Chih Hsieh, Wei-Feng Ni, Sheng-Myn Chuang, Teng-Kuei Chuang, Chih-Ming Ke, Jacky Huang, Shiuan-An Rao, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan); Aysegul Cumurcu Gysen, Maxime d'Alfonso, ASML Netherlands B.V. (Netherlands); Jenny Yueh, ASML Taiwan Ltd. (Taiwan); Pavel Izikson, Aileen Soco, ASML Netherlands B.V. (Netherlands); Jon Wu, ASML Taiwan Ltd. (Taiwan); Tjitte Nooitgedagt, Jeroen Ottens, Yong Ho Kim, Martin Ebert, ASML Netherlands B.V. (Netherlands)
Show Abstract
EPE analysis of sub-N10 BEoL flow with and without fully self-aligned via using Coventor SEMulator3D
Paper 10145-81
Time: 6:00 PM - 8:00 PM
Author(s): Joern-Holger Franke, Matthew Gallagher, Gayle Murdoch, Sandip Halder, IMEC (Belgium); Aurelie Junckers, William Clark, Coventor, SARL (France)
Show Abstract
Verification methodology of retarget value accuracy using pattern library
Paper 10145-82
Time: 6:00 PM - 8:00 PM
Author(s):
Show Abstract
Enhanced 28nm FD-SOI diffraction based overlay metrology based on holistic metrology qualification
Paper 10145-83
Time: 6:00 PM - 8:00 PM
Author(s): Florent Dettoni, Régis Bouyssou, Christophe Dezauzier, STMicroelectronics (France); Jerome Depre, ASML Netherlands B.V. (Netherlands), ASML (France); Steffen Meyer, ASML Netherlands BV (Germany); Christopher Prentice, ASML (France)
Show Abstract
New alignment mark design structures for higher diffraction order wafer quality enhancement
Paper 10145-84
Time: 6:00 PM - 8:00 PM
Author(s): Libin Zhang, Institute of Microelectronics (China); Yaobin Feng, XMC (China); Lisong Dong, Xiaojing Su, Institute of Microelectronics (China); Zhengguo Tian, Chao Fang, XMC (China); Yayi Wei, Tianchun Ye, Institute of Microelectronics (China)
Show Abstract
High throughput and dense sampling metrology for process control
Paper 10145-86
Time: 6:00 PM - 8:00 PM
Author(s): Lei Sun, GLOBALFOUNDRIES Inc. (United States); Tsunehito Kohyama, Kuniaki Takeda, Hiroto Nozawa, Lasertec Corp. (Japan); Yuji Asakawa, Lasertec USA Inc. (United States); Taher Kagalwala, Granger Lobb, Frank Mont, Xintuo Dai, Shaym Pal, Wenhui Wang, Jongwook Kye, Francis Goodwin, GLOBALFOUNDRIES Inc. (United States)
Show Abstract
Efficient hybrid metrology for focus, CD, and overlay
Paper 10145-87
Time: 6:00 PM - 8:00 PM
Author(s): Wim Tel, Bart Segers, Roy Anunciado, Y. Zhang, ASML Netherlands B.V. (Netherlands); Patrick Wong, IMEC (Belgium); Tanbir Hasan, ASML US, Inc. (United States); Christopher Prentice, ASML SARL (France)
Show Abstract
CDC-ratio prediction using OPC model for WLCDU improvement in memory devices
Paper 10145-88
Time: 6:00 PM - 8:00 PM
Author(s):
Show Abstract
Reducing the overlay metrology sensitivity to perturbations of the measurement stack
Paper 10145-89
Time: 6:00 PM - 8:00 PM
Author(s): Yue Zhou, DeNeil D. Park, GLOBALFOUNDRIES Inc. (United States); Karsten Gutjahr, Abhishek Gottipati, Tam Vuong, Sung Yong Bae, Nicholas Stokes, GLOBALFOUNDRIES (United States); Aiqin Jiang, Po Ya Hsu, Mark O'Mahony, ASML US, Inc. (United States); Andrea Donini, Bart Visser, Chris de Ruiter, Grzegorz Grzela, Hans van der Laan, ASML Netherlands B.V. (Netherlands); Martin Jak, ASML (Netherlands); Pavel Izikson, Stephen Morgan, ASML Netherlands B.V. (Netherlands)
Show Abstract
Further study on overlay AEI-ADI shift on contact layer of advanced technology node
Paper 10145-90
Time: 6:00 PM - 8:00 PM
Author(s):
Show Abstract
Lab- and field-test results of MFIG, the first real-time vacuum-contamination sensor
Paper 10145-93
Time: 6:00 PM - 8:00 PM
Author(s): Diederik J. Maas, Pim M. Muilwijk, Michel van Putten, Frank de Graaf, Olaf Kievit, Patrique Boerboom, Norbert B. Koster, TNO (Netherlands)
Show Abstract
CD uniformity control for thick resist process
Paper 10145-94
Time: 6:00 PM - 8:00 PM
Author(s): Chi-hao Huang, Yu-Lin Liu, Weihung Wang, Mars Yang, Elvis Yang, T. H. Yang, K. C. Chen, Macronix International Co., Ltd. (Taiwan)
Show Abstract
Enhanced methodology of focus control and monitoring on scanner tool
Paper 10145-96
Time: 6:00 PM - 8:00 PM
Author(s): Yen-Jen Chen, Young Ki Kim, Xueli Hao, Juan-Manuel Gomez, GLOBALFOUNDRIES Inc. (United States); Ye Tian, Ferhad Kamalizadeh, Justin K. Hanson, ASML (United States)
Show Abstract
Wafer-shape based in-plane distortion predictions using superfast 4G metrology
Paper 10145-97
Time: 6:00 PM - 8:00 PM
Author(s): Leon van Dijk, ASML Netherlands B.V. (Netherlands); Jeffrey Mileham, Ultratech, Inc. (United States); Ilja Malakhovsky, ASML Netherlands B.V. (Netherlands); David Laidler, Harold Dekkers, Sven Van Elshocht, IMEC (Belgium); Doug Anberg, David M. Owen, Ultratech, Inc. (United States); Richard J. F. van Haren, ASML Netherlands B.V. (Netherlands)
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Monitoring of multi-patterning processes in production environment
Paper 10145-98
Time: 6:00 PM - 8:00 PM
Author(s): Sangjun Han, Honggo Lee, Jaesun Woo, Seungyoung Kim, SK Hynix, Inc. (Korea, Republic of); Wan-Soo Kim, Stefan Buhl, Boris Habets, Qoniac GmbH (Germany); Seop Kim, Qoniac Korea Co., Ltd. (Korea, Republic of)
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Process control using adaptive matrix-form affine projection filtering algorithm
Paper 10145-99
Time: 6:00 PM - 8:00 PM
Author(s):
Show Abstract
Improved multi-beam laser interference lithography system by vibration analysis model
Paper 10145-100
Time: 6:00 PM - 8:00 PM
Author(s): Te-Hsun Lin, Yin-Kuang Yang, Hsuan-Ying Mai, Chien-Chung Fu, National Tsing Hua Univ. (Taiwan)
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Numerical investigation of measurement characteristics of through-focus scanning optical microscopy (TSOM) measures under focused Gaussian beam illumination
Paper 10145-101
Time: 6:00 PM - 8:00 PM
Author(s):
Show Abstract
A pattern-based method to automate mask inspection files
Paper 10145-102
Time: 6:00 PM - 8:00 PM
Author(s): Ezni Aznida Kamal Baharin, Mohamad Fahmi Muhsain, Muhamad Asraf Ahmad Ibrahim, Ahmad Nurul Ihsan Ahmad Noorhani, Silterra Malaysia Sdn. Bhd. (Malaysia); Jason Sweis, Cadence Design Systems, Inc. (Germany); Ya-Chieh Lai, Philippe Hurat, Cadence Design Systems, Inc. (United States)
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SAQP pitch walk metrology using single target metrology
Paper 10145-104
Time: 6:00 PM - 8:00 PM
Author(s): Fang Fang, GLOBALFOUNDRIES Inc. (United States); Pedro P. Herrera, KLA-Tencor New York (United States); Taher Kagalwala, GLOBALFOUNDRIES Inc. (United States); Janay Camp, KLA-Tencor New York (United States); Alok Vaid, GLOBALFOUNDRIES Inc. (United States); Stilian Pandev, Franz X. Zach, KLA-Tencor Corp. (United States)
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Projection lens testing with Moiré effect
Paper 10145-105
Time: 6:00 PM - 8:00 PM
Author(s): Mikhail Loktev, Liteq BV (Netherlands); Yifeng Shao, Technische Univ. Delft (Netherlands)
Show Abstract
Photolithography enhanced APC for semiconductor manufacturing
Paper 10145-106
Time: 6:00 PM - 8:00 PM
Author(s): Siew Ing Yet, Adam Sing Hung Hu, X-FAB Sarawak Sdn. Bhd. (Malaysia)
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Detection of distorted wafer using stepper alignment control
Paper 10145-107
Time: 6:00 PM - 8:00 PM
Author(s): Siew Ing Yet, Colin Jan Yang Voon, X-FAB Sarawak Sdn. Bhd. (Malaysia)
Show Abstract
Advanced carbon nanotube (CNT) tips for CD-AFM metrology
Paper 10145-109
Time: 6:00 PM - 8:00 PM
Author(s): Byong Chon Park, Sanjeev Kumar Kanth, Hyun Ryu, Korea Research Institute of Standards and Science (Korea, Republic of); Ronald G. Dixson, Ndubuisi George G. Orji, National Institute of Standards and Technology (United States)
Show Abstract
Precise design-based defect characterization and root cause analysis
Paper 10145-110
Time: 6:00 PM - 8:00 PM
Author(s): Qian Xie, Panneerselvam Venkatachalam, Julie Lee, GLOBALFOUNDRIES Inc. (United States); Zhijin Chen, Khurram Zafar, Anchor Semiconductor, Inc. (United States)
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TurboShape focus and dose metrology: from computational target design to experimental validation of metrology performance
Paper 10145-111
Time: 6:00 PM - 8:00 PM
Author(s): Myungjun Lee, KLA-Tencor Corp. (United States); Antonio Mani, KLA-Tencor Italy SRL (Italy); Wanglei Han, KLA-Tencor Corp. (United States); Sanjay H. Kapasi, Alessandro Vaglio Pret, Mark D. Smith, KLA-Tencor Texas (United States); Pradeep K. Subrahmanyan, Ady Levy, KLA-Tencor Corp. (United States)
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Wednesday 1 March Show All Abstracts
Session 8:
Line Edge Roughness (LER)
Wednesday 1 March 2017
8:20 AM - 10:00 AM
Location: Convention Center 220B
Session Chairs:
John A. Allgair, International Consortium for Advanced Manufacturing Research (ICAMR) (United States) ;
Benjamin D. Bunday, CNSE/SEMATECH (United States)
Global minimization line-edge roughness analysis of top down SEM images (Invited Paper)
Paper 10145-34
Time: 8:20 AM - 8:50 AM
Author(s): Barton G. Lane, Tokyo Electron America, Inc. (United States); Chris A. Mack, Lithoguru.com (United States); Nasim Eibagi, Peter Ventzek, Tokyo Electron America, Inc. (United States)
Show Abstract
Level crossing methodology applied to line-edge roughness characterization (Invited Paper)
Paper 10145-35
Time: 8:50 AM - 9:20 AM
Author(s): Chris A. Mack, Lithoguru.com (United States); Timothy A. Brunner, Xuemei Chen, Lei Sun, GLOBALFOUNDRIES Inc. (United States)
Show Abstract
Multitaper and multisegment spectral estimation of line-edge roughness
Paper 10145-36
Time: 9:20 AM - 9:40 AM
Author(s): Yao Luo, Serap A. Savari, Texas A&M Univ. (United States)
Show Abstract
An OCD perspective of line edge and line width roughness metrology
Paper 10145-37
Time: 9:40 AM - 10:00 AM
Author(s): Ravi K. Bonam, IBM Corp. (United States); Gangadhara R. Muthinti, Mary Breton, Chi-Chun Liu, Stuart Sieg, Indira Seshadri, Nicole Saulnier, Jeffrey Shearer, Raghuveer Patlolla, Huai Huang, IBM (United States)
Show Abstract
Coffee Break 10:00 AM - 10:30 AM
Session 9:
SEM I
Wednesday 1 March 2017
10:30 AM - 12:00 PM
Location: Convention Center 220B
Session Chairs:
Ofer Adan, Applied Materials, Ltd. (Israel) ;
Shunsuke Koshihara, Hitachi High-Technologies Corp. (Japan)
Enabling CD SEM metrology for 5nm technology node and beyond (Invited Paper)
Paper 10145-38
Time: 10:30 AM - 11:00 AM
Author(s): Gian F. Lorusso, IMEC (Belgium); Takeyoshi Ohashi, Astuko Yamaguchi, Hitachi, Ltd. (Japan); Osamu Inoue, Hitachi High-Technologies Corp. (Japan); Takumichi Sutani, Hitachi Ltd. (Japan), Hitachi High-Technologies Corp. (Japan); Naoto Horiguchi, Jürgen Bömmels, Chris Wilson, Basoene Briggs, Chi Lim Tan, Tom Raymaekers, Romain Delhougne, Geert Vandenberghe, Luca Di Piazza, Gouri Sankar Kar, Arnaud Furnémont, Andrea Fantini, IMEC (Belgium); Gabriele L. Donadio, Hitachi High-Technologies Corp. (Japan); Laurent Souriau, Davide Francesco Crotti, Farrukh Yasin, Raf Appeltans, Siddharth Rao, Danilo De Simone, Paulina Rincon Delgadillo, Philippe Leray, Anne-Laure Charley, Daisy Zhou, Anabela Veloso, Nadine Collaert, IMEC (Belgium); kazuhisa hasumi, Hitachi Ltd. (Japan); Shunsuke Koshihara, Masami Ikota, Yutaka Okagawa, Hitachi High-Technologies Corp. (Japan); Toru Ishimoto, Hitachi High-Tech Science Corp. (Japan)
Show Abstract
Framework for SEM contour analysis
Paper 10145-39
Time: 11:00 AM - 11:20 AM
Author(s): Loïc Schneider, Vincent Farys, Emmanuelle Serret, STMicroelectronics (France); Claire Fenouillet-Beranger, CEA-LETI (France)
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Robust 2D patterns process variability assessment using CD-SEM contour extraction offline metrology
Paper 10145-40
Time: 11:20 AM - 11:40 AM
Author(s): Amine Lakcher, STMicroelectronics (France), Lab. des Technologies de La Microélectronique, Ctr. National de la Recherche Scientifique (France); Bertrand Le-Gratiet, Julien Ducoté, Pierre Fanton, STMicroelectronics (France); Ton Kiers, Jan-Willem Gemmink, ASML Netherlands B.V. (Netherlands); Stefan Hunsche, ASML US, Inc. (United States); Christopher Prentice, ASML SARL (France); Maxime Besacier, LTM CNRS (France)
Show Abstract
CD-SEM distortion quantification for EPE metrology and contour analysis
Paper 10145-41
Time: 11:40 AM - 12:00 PM
Author(s): Harm Dillen, Ton Kiers, ASML Netherlands B.V. (Netherlands); Sandip Halder, IMEC (Belgium); Thomas I. Wallow, ASML Brion (United States); Frieda van Roey, IMEC (Belgium)
Show Abstract
Lunch/Exhibition Break 12:00 PM - 1:30 PM
Session 10:
Inspection and Reference Metrology
Wednesday 1 March 2017
1:30 PM - 3:10 PM
Location: Convention Center 220B
Session Chairs:
John C. Robinson, KLA-Tencor Texas (United States) ;
Matthew J. Sendelbach, Nova Measuring Instruments Inc. (United States)
Assessing the wavelength extensibility of optical patterned defect inspection
Paper 10145-42
Time: 1:30 PM - 1:50 PM
Author(s): Bryan M. Barnes, Hui Zhou, Mark-Alexander Henn, Martin Y. Sohn, Richard M. Silver, National Institute of Standards and Technology (United States)
Show Abstract
Anamorphic approach for developing hi-efficiency illumination system to inspect defects on semiconductor wafers
Paper 10145-43
Time: 1:50 PM - 2:10 PM
Author(s): Woojun Han, Sunseok Yang, Ohhyung Kwon, Myongji Univ. (Korea, Republic of); Seungyong Chu, Seungchul Oh, Woosung Jung, Auros Technology, Inc. (Korea, Republic of); Jaisoon Kim, Myongji Univ. (Korea, Republic of)
Show Abstract
3D-profile measurement of advanced semiconductor features by using FIB as reference metrology
Paper 10145-67
Time: 2:10 PM - 2:30 PM
Author(s): Kiyoshi Takamasu, Yuuki Iwaki, Satoru Takahashi, The Univ. of Tokyo (Japan); Hiroki Kawada, Masami Ikota, Hitachi High-Technologies Corp. (Japan)
Show Abstract
1.5nm fabrication of test patterns for characterization of metrological systems
Paper 10145-45
Time: 2:30 PM - 2:50 PM
Author(s): Sergey Babin, Abeam Technologies, Inc. (United States); Nathalie Bouet, Brookhaven National Lab. (United States); Stefano Cabrini, Lawrence Berkeley National Lab. (United States); Giuseppe Calafiore, Abeam Technologies, Inc. (United States); Raymond P. Conley, Brookhaven National Lab. (United States), Argonne National Lab. (United States); Gevork Gevorkyan, Lawrence Berkeley National Lab. (United States); Keiko Munechika, Abeam Technologies, Inc. (United States); András E. Vladár, National Institute of Standards and Technology (United States); Valeriy V. Yashchuk, Lawrence Berkeley National Lab. (United States)
Show Abstract
Fabrication of metrology test structures with helium ion beam direct write
Paper 10145-46
Time: 2:50 PM - 3:10 PM
Author(s): Chien-Lin Lee, Sheng-Wei Chien, Sheng-Yung Chen, Chun-Hung Liu, Kuen-Yu Tsai, Jia-Han Li, National Taiwan Univ. (Taiwan); Bor-Yuan Shew, Chitsung Hong, National Synchrotron Radiation Research Ctr. (Taiwan); Chao-Te Lee, Instrument Technology Research Ctr., National Applied Research Labs. (Taiwan)
Show Abstract
Coffee Break 3:10 PM - 3:40 PM
Session 11:
Optical Metrology
Wednesday 1 March 2017
3:40 PM - 6:00 PM
Location: Convention Center 220B
Session Chairs:
Eric Solecky, GLOBALFOUNDRIES Inc. (United States) ;
Christopher J. Raymond, Nanometrics Inc. (United States)
High-NA optical CD metrology on small in-cell targets enabling improved higher order dose control and process control for logic
Paper 10145-47
Time: 3:40 PM - 4:00 PM
Author(s): Hugo Cramer, Elliott McNamara, ASML Netherlands B.V. (Netherlands); Rik van Laarhoven, Ram Jaganatharaja, ASML Netherlands BV (Netherlands); Isabel de la Fuente, Sharon Hsu, ASML Netherlands B.V. (Netherlands); Filippo Belletti, Milos Popadic, ASML Netherlands BV (Netherlands); Ward Tu, Wade Huang, ASML Taiwan Ltd. (Taiwan)
Show Abstract
Complex metrology on 3D structures using multi-channel OCD
Paper 10145-48
Time: 4:00 PM - 4:20 PM
Author(s): Taher Kagalwala, Sridhar Mahendrakar, Alok Vaid, GLOBALFOUNDRIES Inc. (United States); Paul K. Isbester, Aron J. Cepler, Nova Measuring Instruments Inc. (United States); Byeong Cheol Kang, Nova Measuring Instruments Ltd. (United States); Naren Yellai, Matthew J. Sendelbach, Nova Measuring Instruments Inc. (United States); Mihael Ko, Nova Measuring Instruments, LTD (Israel); Ovadia Ilgayev, Nova Measuring Instruments Ltd. (Israel); Yinon Katz, Lilach Tamam, Ilya Osherov, Nova Measuring Instruments, LTD (Israel)
Show Abstract
Optical metrology strategies for inline 7nm CMOS logic product control
Paper 10145-49
Time: 4:20 PM - 4:40 PM
Author(s): Michael Lenahan, Sridhar Mahendrakar, Alok Vaid, Taher Kagalwala, GLOBALFOUNDARIES (United States); Kartik Venkataraman, KLA-Tencor (United States); Dawei Hu, Ming Di, Da Song, Janay Camp, Zhou Ren, Nam Hee Yoon, KLA-Tencor Corp. (United States)
Show Abstract
Evaluating the effects of modeling errors for isolated finite 3D targets
Paper 10145-50
Time: 4:40 PM - 5:00 PM
Author(s): Mark-Alexander Henn, Bryan M. Barnes, Hui Zhou, National Institute of Standards and Technology (United States)
Show Abstract
Scatterometry control for multiple electron beam lithography
Paper 10145-51
Time: 5:00 PM - 5:20 PM
Author(s): Yoann Blancquaert, CEA-LETI (France); Nivea G. S. Figueiro, Nova Measuring Instruments GmbH (Germany); Thibault Labbaye, CEA-LETI (France); Francisco Sanchez, Stephane Heraud, Nova Measuring Instruments GmbH (Germany); Roy Koret, Nova Measuring Instruments Ltd. (Israel); Matthew J. Sendelbach, Nova Measuring Instruments Inc. (United States); Ralf Michel, Nova Measuring Instruments GmbH (Germany); Shay Wolfling, Nova Measuring Instruments Ltd. (Israel); Stephane Rey, Laurent Pain, CEA-LETI (France)
Show Abstract
Advanced optical modeling of TiN metal hard mask for scatterometric critical dimension metrology
Paper 10145-52
Time: 5:20 PM - 5:40 PM
Author(s): Peter Ebersbach, GLOBALFOUNDARIES (Germany); Adam M. Urbanowicz, Nova Measuring Instruments (Germany); Dmitriy Likhachev, GLOBALFOUNDARIES Dresden Module One LLC & Co. (Germany); Carsten Hartig, GLOBALFOUNDARIES (Germany)
Show Abstract
Advanced applications of scatterometry based optical metrology
Paper 10145-53
Time: 5:40 PM - 6:00 PM
Author(s): Dhairya Dixit, GLOBALFOUNDRIES Inc. (United States); Nick Keller, Nanometrics Inc. (United States); Taher Kagalwala, Fiona Rechhia, GLOBALFOUNDRIES Inc. (United States); Lifshitz Yevgeny, Nanometrics Inc. (United States); Alexander Elia, Vinit Todi, Jody Fronheiser, GLOBALFOUNDRIES Inc (United States); Alok Vaid, GLOBALFOUNDRIES Inc. (United States)
Show Abstract
Thursday 2 March Show All Abstracts
Session 12:
3D SEM and 3D Applications
Thursday 2 March 2017
8:00 AM - 10:00 AM
Location: Convention Center 220B
Session Chairs:
John A. Allgair, International Consortium for Advanced Manufacturing Research (ICAMR) (United States) ;
Masafumi Asano, Toshiba Corp. (Japan)
SEM image prediction based on modeling of electron-solid interaction
Paper 10145-54
Time: 8:00 AM - 8:20 AM
Author(s): Toshimasa Kameda, Satoshi Takada, Makoto Suzuki, Hitachi High-Technologies Corp. (Japan); Toshiyuki Yokosuka, Hitachi Ltd. (Japan); Sergey S. Borisov, Sergey Babin, Abeam Technologies, Inc. (United States)
Show Abstract
SEM voltage contract imaging for contact area measurement of vertical nanotube interconnect
Paper 10145-115
Time: 8:20 AM - 8:40 AM
Author(s): Yusuke Abe, Hitachi High-Technologies Corp. (Japan), Santa Clara Univ. (United States); Anshul A. Vyas, Richard Senegor, Cary Y. Yang, Santa Clara Univ. (United States)
Show Abstract
SEM-based overlay measurement between via patterns and buried M1 patterns using high-voltage SEM
Paper 10145-56
Time: 8:40 AM - 9:00 AM
Author(s): Kazuhisa Hasumi, Osamu Inoue, Yutaka Okagawa, Chuanyu Shao, Hitachi High-Technologies Corp. (Japan); Philippe Leray, Sandip Halder, Gian F. Lorusso, Christiane Jehou, IMEC (Belgium)
Show Abstract
High-precision CD measurement using energy-filtering SEM techniques
Paper 10145-57
Time: 9:00 AM - 9:20 AM
Author(s): Daisuke Bizen, Makoto Sakakibara, Hitachi, Ltd. (Japan); Makoto Suzuki, Yoshinori Momonoi, Hajime Kawano, Hitachi High-Technologies Corp. (Japan)
Show Abstract
SEM imaging capability for advanced nano-structures and its application to metrology
Paper 10145-58
Time: 9:20 AM - 9:40 AM
Author(s): Makoto Suzuki, Uki Ikeda, Yuji Kasai, Yuzuru Mizuhara, Takanori Kishimoto, Ichiro Tachibana, Naomasa Suzuki, Hajime Kawano, Hitachi High-Technologies Corp. (Japan)
Show Abstract
3D SEM characterization of advanced sidewall patterning process (Conference Presentation)
Paper 10145-59
Time: 9:40 AM - 10:00 AM
Author(s): Shimon Levi, Applied Materials, Ltd. (Israel)
Show Abstract
Coffee Break 10:00 AM - 10:30 AM
Presentation of the Karel Urbanek Best Student Paper Award
Thursday 2 March 2017
10:30 AM - 10:40 AM
Location: Convention Center 220B


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Session 13:
Design Interactions with Metrology: Joint Session with Conferences 10148 and 10145
Thursday 2 March 2017
10:40 AM - 12:00 PM
Location: Convention Center 220B
Session Chairs:
Jason P. Cain, Advanced Micro Devices, Inc. (United States) ;
John C. Robinson, KLA-Tencor Texas (United States)
Wafer hot spot identification through advanced photomask characterization techniques: part 2
Paper 10148-20
Time: 10:40 AM - 11:00 AM
Author(s): Yohan Choi, Michael Green, Photronics, Inc. (United States); Young-Woong Cho, Photronics (United States); Young M. Ham, Photronics, Inc. (United States); Howard Lin, Andy Lan, Richer Yang, Hsien-Yen Lung, Inotera Memories Inc. (Taiwan)
Show Abstract
Pattern centric design based sensitive patterns and process monitor in manufacturing
Paper 10145-60
Time: 11:00 AM - 11:20 AM
Author(s): Chingyun Hsiang, Anchor Semiconductor, Inc. (United States); Guojie Cheng, Anchor Semiconductor, Inc. (China); Kechih Wu, Anchor Semiconductor Inc (United States)
Show Abstract
The use of computational inspection to identify process window limiting hotspots and predict sub-15nm defects with high capture rate
Paper 10145-61
Time: 11:20 AM - 11:40 AM
Author(s): Boo-Hyun Ham, Il-Hwan Kim, Sung-Sik Park, Sun-Young Yeo, Sang-Jin Kim, Dong-Woon Park, Joon-Soo Park, SAMSUNG Electronics Co., Ltd. (Korea, Republic of); Chang-Hoon Ryu, Bo-Kyeong Son, Kyung-Bae Hwang, Jae-Min Shin, Jangho Shin, Ki-Yeop Park, ASML Korea Co., Ltd. (Korea, Republic of); Sean Park, Lei Liu, Ming-Chun Tien, Angelique Nachtwein, Marinus Jochemsen, ASML Brion (United States); Philip Yan, Vincent Hu, Brion Technologies (Shenzhen) Co., Ltd. (China); Christopher Jones, ASML Brion (United States)
Show Abstract
Line-edge quality optimization of electron beam resist for high-throughput character projection exposure utilizing atomic force microscope analysis
Paper 10148-33
Time: 11:40 AM - 12:00 PM
Author(s): Rimon Ikeno, Yoshio Mita, Kunihiro Asada, The Univ. of Tokyo (Japan)
Show Abstract
Lunch Break 12:00 PM - 1:30 PM
Session 14:
SEM II
Thursday 2 March 2017
1:30 PM - 3:00 PM
Location: Convention Center 220B
Session Chairs:
Timothy F. Crimmins, Intel Corp. (United States) ;
Alok Vaid, GLOBALFOUNDRIES Inc. (United States)
CD-SEM metrology and OPC modeling for 2D patterning in advanced technology nodes (Conference Presentation) (Invited Paper)
Paper 10145-62
Time: 1:30 PM - 2:00 PM
Author(s): Thomas I. Wallow, Chen Zhang, ASML Brion (United States); Anita Fumar-Pici, ASML US, Inc. (United States); Jun Chen, Bart Laenens, Christopher A. Spence, David Rio, ASML Brion (United States); Paul van Adrichem, Harm Dillen, Jing Wang, ASML Netherlands B.V. (Netherlands); Peng-Cheng Yang, ASML Brion (United States); Werner Gillijns, Patrick Jaenen, Frieda van Roey, Jeroen van de Kerkhove, IMEC (Belgium); Sergey Babin, Abeam Technologies, Inc. (United States)
Show Abstract
Using the analytical linescan model for SEM metrology
Paper 10145-63
Time: 2:00 PM - 2:20 PM
Author(s): Chris A. Mack, Lithoguru.com (United States); Benjamin D. Bunday, GLOBALFOUNDRIES Inc. (United States)
Show Abstract
High-throughput multi-beam SEM: quantitative analysis of imaging capabilities at IMEC-N10 logic node
Paper 10145-64
Time: 2:20 PM - 2:40 PM
Author(s): Jens Timo Neumann, Carl Zeiss SMT GmbH (Germany); Tomasz Garbowski, Carl Zeiss Microscopy GmbH (Germany); Wolfgang Högele, Thomas Korb, Carl Zeiss SMT GmbH (Germany); Sandip Halder, Philippe Leray, IMEC (Belgium); Reiner Garreis, Carl Zeiss SMT GmbH (Germany); Michel le Maire, Dirk Zeidler, Carl Zeiss Microscopy GmbH (Germany)
Show Abstract
SEM review color imaging detection of gate to source/drain short in 14nm finFET device (Conference Presentation)
Paper 10145-65
Time: 2:40 PM - 3:00 PM
Author(s): Kwame Owusu-Boahen, SAMSUNG Austin Semiconductor LLC (United States); JaeHun Park, HyeJung Lee, SAMSUNG Electronics Co., Ltd. (Korea, Republic of)
Show Abstract
Coffee Break 3:00 PM - 3:30 PM
Session 15:
Late Breaking News
Thursday 2 March 2017
3:30 PM - 5:30 PM
Location: Convention Center 220B
Session Chairs:
Martha I. Sanchez, IBM Research - Almaden (United States) ;
Vladimir A. Ukraintsev, Qorvo, Inc. (United States)
Materials characterization for process integration of multi-channel gate all around (GAA) devices
Paper 10145-66
Time: 3:30 PM - 3:50 PM
Author(s): Gangadhara Raja Muthinti, Nicolas Loubet, Robin Chao, Abraham A. de la Pena, Juntao Li, Michael A. Guillorn, Tenko Yamashita, Sivananda Kanakasabapathy, John Gaudiello, IBM Corp. (United States); Aron J. Cepler, Matthew J. Sendelbach, Susan Emans, Nova Measuring Instruments Inc. (United States); Shay Wolfling, Avron Ger, Daniel Kandel, Roy Koret, Nova Measuring Instruments Ltd. (Israel); Wei Ti Lee, ReVera, Inc. (United States); Peter Gin, Kevin Matney, Matthew Wormington, Bruker Corp. (United States)
Show Abstract
Molecular dynamics and dynamic Monte-Carlo simulation of irradiation damage with focused ion beams
Paper 10145-68
Time: 3:50 PM - 4:10 PM
Author(s): Kaoru Ohya, The Univ. of Tokushima (Japan)
Show Abstract
"Non-destructive" dimensional metrology of EUV resist gratings (Conference Presentation)
Paper 10145-69
Time: 4:10 PM - 4:30 PM
Author(s): R. Joseph Kline, Daniel F. Sunday, Donald Windover, National Institute of Standards and Technology (United States); Tero S. Kulmala, Yasin Ekinci, Paul Scherrer Institute, ETH Zürich (Switzerland)
Show Abstract
Application of advanced hybrid metrology method to nanoimprint lithography
Paper 10145-108
Time: 4:30 PM - 4:50 PM
Author(s): Ilya Osherov, Limor Issacharoff, Oram Gedalia, Nova Measuring Instruments Ltd. (Israel); Koichi Wakamoto, Nova Measuring Instruments K.K. (Japan); Matthew J. Sendelbach, Nova Measuring Instruments Inc. (United States); Masafumi Asano, Toshiba Corp. (Japan)
Show Abstract
Connected component analysis of review-SEM images for sub-10nm node process verification
Paper 10145-112
Time: 4:50 PM - 5:10 PM
Author(s): Sandip Halder, Philippe Leray, IMEC (Belgium); Kaushik Sah, KLA-Tencor California (United States); Andrew J. Cross, KLA-Tencor England (United Kingdom); Paolo Parisi, KLA-Tencor Italy SRL (Italy)
Show Abstract
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