San Jose Convention Center and San Jose Marriott
San Jose, California, United States
12 - 16 February 2012
Conference 8323
Alternative Lithographic Technologies IV
Monday - Thursday 13 - 16 February 2012
Important
Dates
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Abstract Due:
12 September 2011

Author Notification:
26 October 2011

Manuscript Due Date:
16 January 2012

Conference
Committee
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Monday 13 February Show All Abstracts
Opening Remarks
Monday 13 February 2012
3:10 PM - 3:30 PM
Location: Conv. Ctr. Ballroom C1
Session 1:
Keynote Session
Monday 13 February 2012
3:30 PM - 5:15 PM
Location: Conv. Ctr. Ballroom C1

NOTE THAT OVERFLOW ROOM WILL BE AVAILABLE. LOCATION ANNOUNCED ONSITE
Future of multiple-e-beam direct-write systems (Keynote Presentation)
Paper 8323-1
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Block copolymer directed self-assembly enables sublithographic patterning for device fabrication (Keynote Presentation)
Paper 8323-2
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Jet and flash imprint lithography: status and roadmap to manufacturing adoption (Keynote Presentation)
Paper 8323-3
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Tuesday 14 February Show All Abstracts
Session 2:
Imprint I: Processing
Tuesday 14 February 2012
8:00 AM - 9:50 AM

NOTE ROOM CHANGE BACK TO A3
Design considerations for UV-NIL resists (Invited Paper)
Paper 8323-4
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Selective transfer of nanostructured assemblies onto an arbitrary substrate by nanoimprinting
Paper 8323-5
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Single-digit nanofabrication by step-and-repeat nanoimprint lithography
Paper 8323-6
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A cost-effective nanoimprint machine
Paper 8323-7
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Nanoimprint and post nanoimprint process for 30nm full field CMOS process using replica quartz template
Paper 8323-8
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Session 3:
Directed Self-Assembly I: Resist Processing: Joint Session with Conference 8325
Tuesday 14 February 2012
10:30 AM - 12:20 PM
Etch resistant block copolymers: high χ and orientation control (Invited Paper)
Paper 8323-9
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Pattern scaling with directed self assembly through lithography and etch process integration
Paper 8323-10
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Solvent annealing strategies for the directed self-assembly of poly(styrene-b-dimethylsiloxane)
Paper 8323-11
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All track directed self-assembly of block copolymers: process flow and origin of defects
Paper 8323-12
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Synthesis and characterization of self-assembling block copolymers containing fluorine groups
Paper 8323-13
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Session 4:
Maskless/Direct-Write Lithography I
Tuesday 14 February 2012
1:30 PM - 3:00 PM
Sub-20nm hybrid lithography using optical, pitch-division, and e-beam (Invited Paper)
Paper 8323-14
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50 keV electron multibeam mask writer for the 11nm HP node: first results of the proof of concept tool (eMET POC)
Paper 8323-15
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Reflective electron-beam lithography: progress toward high-throughput production capability
Paper 8323-16
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Implications of multiple e-beam maskless lithography on process, design, and CAD tools
Paper 8323-17
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Session 5:
Modeling of Alternative Lithographic Processes
Tuesday 14 February 2012
3:30 PM - 4:50 PM
Influence of thermal load on 450 mm Si-wafer IPD during lithographic patterning
Paper 8323-18
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Self-consistent field theory of directed self-assembly in laterally confined lamellae-forming diblock copolymers
Paper 8323-19
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Models for the power spectra of thermal composition fluctuations and line-edge roughness in an ordered lamellar diblock copolymer melt
Paper 8323-20
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Modeling block copolymer directed self-assembly on chemically patterned substrates: effect of mismatch between the morphology and pattern
Paper 8323-21
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Panel Discussion: EUVL isn't the Solution: Are the Alternative Lithographics Technologies Ready?
Tuesday 14 February 2012
5:00 PM - 7:00 PM

Moderators:
Doug Resnick, Molecular Imprints, Inc.
Will Tong, KLA-Tencor Corp.

Panelists:
Chris Bevis, KLA-Tencor Corp.
Tatsuhiko Higashiki, Toshiba Corp.
Burn Lin, Taiwan SemiconductorsManufacturing Co., Ltd.
Moshe Preil, GLOBALFOUNDRIES Inc.
S.V. Sreenivasan, Molecular Imprints, Inc.

Over the last two years, the combination of 193nm immersion lithography and self aligned spacer double patterning (SADP) has reduced the half pitch by close to a factor of two. However, at the upcoming half pitches of 16nm and 12nm, double patterning is no longer sufficient. EUVL has been deemed by some to be the successor, and its development has advanced to the point where first generation EUV tools have been shipped and second generation tools are planned for late 2012. But throughput problems caused by insufficient source power remain the key roadblock for a technology that is needed as soon as the next two years. Even if this issue is resolved, other challenging requirements, such as actinic inspection and a viable resist, remain.

This leaves the door open to alternative solutions such as imprint, maskless/direct write, and directed self-assembly. If these potential solutions can address cost of ownership and demonstrate superior technical progress necessary for the industry to invest the proper resources, then there is an opportunity to insert these technologies into production. This panel discussion will review the progress made in each of the alternative lithographic technologies and identify the gaps that need to be addressed to move these technologies forward. Both equipment manufacturers and end users will be asked to address issues such as resolution, throughput, defectivity, and infrastructure readiness.

Panel Sponsored by
Wednesday 15 February Show All Abstracts
Session 6:
Metrology and Inspection for Alternative Lithographic Technologies: Joint Session with Conference 8324
Wednesday 15 February 2012
8:00 AM - 10:10 AM
Location: Conv. Ctr. Ballroom J2

NOTE ROOM CHANGE FOR SESSION 6
Directed self-assembly defectivity assessment. Part II (Invited Paper)
Paper 8323-22
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Pattern density multiplication by direct self assembly of block copolymers: toward 300mm CMOS requirements
Paper 8323-23
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Measurement of placement error between self-assembled polymer patterns and guiding chemical prepatterns
Paper 8323-24
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Characterization of cross-sectional profile of epitaxially assembled block copolymer domains using transmission small angle x-ray scattering
Paper 8323-25
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Session 7:
Hybrid Directed Self-Assembly and Imprint Processes (DSA II and Imprint II)
Wednesday 15 February 2012
10:30 AM - 12:20 PM

NOTE ROOM CHANGE BACK TO A3
Patterned media: disk drive technology at the frointier of lithography (Invited Paper)
Paper 8323-26
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Evaluation of ordering of directed self-assembly of block copolymers with pre-patterned guides for bit patterned media
Paper 8323-27
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Integration of nanoimprint lithography into block copolymer directed self-assembly for fabricating nanoimprint templates and bit-patterned media over 1 teradot/in2
Paper 8323-28
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Line-frequency doubling of directed self-assembly patterns for single-digit bit pattern media lithography
Paper 8323-29
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Imprint process performance for patterned media at densities greater than 1Tb/in2
Paper 8323-30
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Session 8:
Directed Self-Assembly III: Patterning
Wednesday 15 February 2012
1:30 PM - 3:10 PM
Contact-hole patterning for random logic circuits using block copolymer directed self-assembly
Paper 8323-31
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Progress towards the integration of optical proximity correction and directed self-assembly of block copolymers with graphoepitaxy
Paper 8323-32
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Contact hole shrink process using directed self-assembly
Paper 8323-33
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Material and process development for block copolymer lithography
Paper 8323-34
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Investigation of high χ block copolymers for directed self-asssembly: synthesis and characterization of PS-b-PHOST
Paper 8323-35
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Session 9:
Maskless/Direct-Write Lithography II
Wednesday 15 February 2012
3:40 PM - 5:30 PM
REBL: design progress toward 16 nm half-pitch maskless projection electron beam lithography (Invited Paper)
Paper 8323-36
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Active-matrix nc-Si electron emitter array for massively parallel direct-write electron-beam system
Paper 8323-37
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Complementary patterning demonstration with e-beam direct writer and spacer DP process of 11nm node
Paper 8323-38
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CP element based design for 14nm node EBDW high volume manufacturing
Paper 8323-39
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Status on resist development for 5kV mapper multibeam application: correlation using different accelerating beam voltage
Paper 8323-40
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Session PS1:
Posters-Wednesday
Wednesday 15 February 2012
6:00 PM - 8:00 PM
Location: Conv. Ctr. Hall 2

All symposium attendees are invited to attend the poster sessions. Come view the high-quality papers that are presented in this alternative format, and interact with the poster author who will be available for discussion. Enjoy light refreshments while networking with colleagues in your field. Attendees are required to wear their conference registration badges to the poster sessions.
Silicon-containing block copolymers for sub-10nm patterning
Paper 8323-60
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Maskless EUV lithography: an already difficult technology made even more complicated?
Paper 8323-61
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A phase segregating polymer blend for 2xnm feature applications
Paper 8323-62
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2nm quantum optical lithography
Paper 8323-63
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Detailed mesoscale dynamic simulation of block copolymer directed self-assembly processes: application of protracted colored noise dynamics
Paper 8323-64
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Novel fluorinated polymers for releasing material in nanoimprint lithography
(Canceled)
Paper 8323-65
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25nm pitch master and replica mold fabrication for nanoimprinting lithography for 1Tbit/inch2 bit patterned media
Paper 8323-66
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Combined dose and geometry correction (DMG) for low energy multi electron beam lithography (5kV): application to the 16nm node
Paper 8323-67
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Analysis of multibeam's scalable column for complementary e-beam lithography (CEBL)
Paper 8323-68
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Multiple columns for high-throughput complementary e-beam lithography (CEBL)
Paper 8323-69
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Addressing LER through atomistic self-assembly
Paper 8323-70
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Plasmonic lithography modeling and measurement of near-field distribution of plasmonic nano-aperture
Paper 8323-71
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Analysis of line-width error in digital micromirror device-based maskless lithography
Paper 8323-72
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Design of a high positioning contact probe for plasmonic lithography
Paper 8323-73
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Sub-30nm resolution plasmonic patterning with a circular contact probe
Paper 8323-74
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Optimization of chemically amplified resist for high-volume manufacturing by electron-beam direct writing toward 14nm node and beyond
Paper 8323-75
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Novel neutralized layers for DSA lithography by using reactive self-assembled monolayers
Paper 8323-76
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Study of device mass production capability of the character projection based electron beam direct writing process technology toward 14 nm node and beyond
Paper 8323-77
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Block co-polymer guided self-assembly by surface chemical modification: optimization of multiple patterning process and pattern transfer
Paper 8323-78
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Proximity effect correction using multilevel area density maps for character projection based electron beam direct writing toward 14 nm node and beyond
Paper 8323-79
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Feasibility study of character projection-based electron-beam direct writing for logic LSI wiring including automatically routed area with 14nm node technology case
Paper 8323-80
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High-resolution laser direct writing with a plasmonic contact probe
Paper 8323-81
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A new polymer working stamp material investigated for replication fidelity
(Canceled)
Paper 8323-82
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Feasibility study of optical/e-beam complementary lithography
Paper 8323-83
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Optimization of MSB for future technology nodes
Paper 8323-85
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Integrated lithography to prepare arrays of rounded nano-objects
Paper 8323-86
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Improved electron backscattering representation using a new class of distribution: application to EUV masks
Paper 8323-87
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Multistage nanofocusing with 22nm resolution
Paper 8323-88
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Fabrication nano-pillars pattern on PDMS using anodic aluminum oxide film as template
Paper 8323-89
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Spin-on surface treatments for thin film block copolymer orientation control
Paper 8323-90
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Environmental control during solvent annealing of silicon-containing block copolymers
Paper 8323-91
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Block copolymer orientation control using top-coat surface treatments
Paper 8323-92
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Nanosphere lithography based technique for fabrication of large area well ordered metal particle arrays
Paper 8323-93
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Ultimate lithographic performances of advanced resists CAR or non-CAR resist?
Paper 8323-95
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Dithering in raster-scan multiple electron-beam maskless lithography system
Paper 8323-96
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Hardware implementation of Corner2 lossless compression algorithm for maskless lithography systems
Paper 8323-97
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Scalable simulations for directed self-assembly patterning with the use of GPU parallel computing
Paper 8323-99
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Modeling line-edge roughness in lamellar block copolymer systems
Paper 8323-100
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Directed self-assembly of poly(styrene)-block-poly(acrylic acid) copolymers for sub-20nm pitch patterning
Paper 8323-101
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Sub-wavelength holographic lithography: the possibilities and advantages
(Canceled)
Paper 8323-102
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Fabrication of polymer microneedle array using bulk lithography and micromolding process
(Canceled)
Paper 8323-103
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Thursday 16 February Show All Abstracts
Session 10:
Imprint III: Templates, Masks, and Molds
Thursday 16 February 2012
8:00 AM - 10:10 AM
Paradigm shift in nanoimprint lithography (Invited Paper)
Paper 8323-41
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Controlling template erosion with advanced cleaning methods
Paper 8323-42
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Nanoimprint template replication from directed self-assembled block copolymer patterns for bit patterned media at 1Tdot/in2
Paper 8323-43
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Fabrication of templates with rectangular bits on circular tracks by combining block copolymer directed self-assembly and nanoimprint lithography
Paper 8323-44
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Nanoimprint templates of 6nm half-pitch lines fabricated by helium ion-beam lithography
Paper 8323-45
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Deformations of soft imprint templates in the nanoimprint lithography
Paper 8323-46
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Session 11:
Frontier Lithographic Techniques and Applications
Thursday 16 February 2012
10:30 AM - 12:20 PM
Airbrushing, ink jet printing, replica molding, and microcontact printing of chitin nanofibers with a "chitin nanofiber ink" (Invited Paper)
Paper 8323-47
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Zone plate focused soft x-ray lithography for fabrication of nanofluidic devices
Paper 8323-48
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New lithographically patterned templates for positioning DNA nanostructures
Paper 8323-49
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Alignment method in plasmonic lithography with a contact optical scanning probe at resonant condition
Paper 8323-50
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Multi-step Scanning Probe Lithography (SPL) on calixarene with overlay alignment
Paper 8323-51
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Session 12:
Imprint IV: R2R Imprint Lithography and Applications
Thursday 16 February 2012
1:30 PM - 3:20 PM
Roll-to-roll manufacturing of electronic devices (Invited Paper)
Paper 8323-52
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Continuous large area nanoscale patterning using cylindrical phase masks
Paper 8323-53
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Sub-100 nm pattern formation by roll-to-roll nanoimprint
Paper 8323-54
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Planarization coating for polyimide substrates used in roll-to-roll fabrication of active matrix backplanes for flexible displays
Paper 8323-55
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Roll-to-roll nanopatterning using jet and flash imprint lithography
Paper 8323-56
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Session 13:
Directed Self-Assembly IV: Materials for Fine Process Control
Thursday 16 February 2012
3:40 PM - 4:50 PM
Designing new materials and processes for directed self-assembly applications (Invited Paper)
Paper 8323-57
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Directed self-assembly of laterally confined lamellae-forming diblock copolymers: polydispersity and substrate interaction effects
Paper 8323-58
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EUVL compatible LER solutions using functional block copolymers
Paper 8323-59
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